ATS-50400G-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1029-ND

Manufacturer Part#:

ATS-50400G-C1-R0

Price: $ 7.63
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 40MM X 40MM X 12.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-50400G-C1-R0 datasheetATS-50400G-C1-R0 Datasheet/PDF
Quantity: 251
1 +: $ 6.93630
10 +: $ 6.74604
25 +: $ 6.37132
50 +: $ 5.99647
100 +: $ 5.62174
250 +: $ 5.24694
500 +: $ 4.87215
1000 +: $ 4.77845
Stock 251Can Ship Immediately
$ 7.63
Specifications
Series: maxiGRIP, maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Angled Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.492" (12.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-50400G-C1-R0 thermal-heat sink is designed for the reliable and efficient removal of heat from various electrical components. The sink is used in industries to reduce the temperature of components in high-stress environments, such as automotive, communications, military, and energy industries. The sink has a unique design that enables it to dissipate heat at an optimal rate, ensuring that components remain cool even under extreme conditions.

The ATS-50400G-C1-R0 thermal-heat sink is comprised of a die-cast aluminum base and a pin-fin array. The base is designed to provide a secure platform to which the fin array can be attached. The fin array consists of a multiplicity of pins which foster the efficient removal of heated air from the components. The pins of the fin array are specifically designed to provide an efficient, turbulence-free path from the heated components to the atmosphere.

The ATS-50400G-C1-R0 thermal-heat sink is designed to provide reliable, long-term cooling of components even under the most extreme conditions. The fin array’s design ensures that heat is dissipated quickly and efficiently. The pin-fins are carefully designed with a specific pitch, geometry, and height to provide maximum dissipation efficiency. Additionally, the die-cast aluminum base provides a secure platform for the fin array, ensuring that no gaps or crevices exist which could compromise the rate of heat dissipation.

The ATS-50400G-C1-R0 is designed to be user-friendly, and can be easily integrated into existing systems. The fin array is straightforward to mount, and the pin-fins can be adjusted to adjust to many different component packages. Additionally, the sink can be simply installed in any number of environments, and can also be easily configured to accommodate a variety of component lengths.

Overall, the ATS-50400G-C1-R0 thermal-heat sink is highly reliable and efficient solution for the cooling of electrical components. It is designed to provide reliable, long-term cooling solutions for high-stress environments, and its user-friendly design makes it easy to integrate into existing systems. The pin-fin array provides a turbulence-free path for efficient heat dissipation, while the die-cast aluminum base ensures that the fin array is securely mounted in place.

The specific data is subject to PDF, and the above content is for reference

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