ATS-50425G-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential for many electronic components such as semiconductors, processors, and memory chips in order to ensure their proper functionality and performance. The ATS-50425G-C1-R0 heat sink is a common choice for cooling these components in numerous applications. This article explains the application field and working principle of the ATS-50425G-C1-R0 heat sink.

The ATS-50425G-C1-R0 heat sink is a pin-fin designed aluminum heat sink optimized for cooling in applications such as PC board to chassis mounting, multi-processor equipment, or single board computers. This product is ideal for assembling components into a sealed unit, as it readily attaches to a ventilated metal chassis with air circulation to absorb excess heat. The ATS-50425G-C1-R0 heat sink is built with a series of aluminum fin pins that are soldered to a heat sink base. This creates a highly efficient dissipation surface to transfer heat from the component to the atmosphere.

The ATS-50425G-C1-R0 heat sink helps reduces the ambient temperature of the enclosed components. This is done by providing a high-performance area to shed off excess heat. This is accomplished through a combination of the thermal resistance (resistance to heat transfer) of the air and the dissipating characteristics of the heat sink fin assembly. This process is known as convection cooling, where the movement of air around the heat sink helps dissipate the heat.

The ATS-50425G-C1-R0 heat sink’s construction allows it to be ideal for applications that require a secured thermal solution. The robust aluminum frame is fixed to the PCB and chassis and ensures efficient heat transfer and protection to the enclosed components. The application of mechanical screws creates a continuous solid connection to the chassis which thermally connects the components to the heat sink. Additionally, air fins are attached to the aluminum frame and provide superior cooling performance and air uniformity. This uniformity helps produce consistent thermal dissipation and a reliable environmental temperature.

The overall design of the ATS-50425G-C1-R0 heat sink enables it to function efficiently. The combination of the thermal resistance of air and the dissipating characteristics of the fin assembly work together to cool the enclosed components. This heat sink is particularly useful for applications that require increased heat dissipation due to its robust construction. The aluminum frame, pins, and air fins effectively absorb and shed heat from enclosed components which can then be safely released into the atmosphere.

In conclusion, the ATS-50425G-C1-R0 heat sink is a highly reliable and efficient product for thermal management in various applications. It is designed with an aluminum frame, pins and air fins which helps provide superior performance and airflow for reliable cooling. The combination of air and heat dissipation properties enables it to be ideal for PC board to chassis mounting, multi-processor equipment, or single board computers. Therefore, the ATS-50425G-C1-R0 heat sink is a highly recommended choice for effectively dissipating and releasing heat.

The specific data is subject to PDF, and the above content is for reference