ATS-50450G-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1031-ND

Manufacturer Part#:

ATS-50450G-C1-R0

Price: $ 7.57
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 45MM X 45MM X 12.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-50450G-C1-R0 datasheetATS-50450G-C1-R0 Datasheet/PDF
Quantity: 539
1 +: $ 6.88590
10 +: $ 6.50097
25 +: $ 6.11856
50 +: $ 5.73628
100 +: $ 5.35380
250 +: $ 4.97141
500 +: $ 4.87581
1000 +: $ 4.78021
Stock 539Can Ship Immediately
$ 7.57
Specifications
Series: maxiGRIP, maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Angled Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.492" (12.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks refer to the process of dissipating excess heat from the core components of an electronic device. Heat sinks are used in almost all electronic components such as processors, memory chips, motherboards, power supplies, and networking equipment. The ATS-50450G-C1-R0 Thermal – Heat Sinks is a very popular choice in the market due to its low profile and small size.

The ATS-50450G-C1-R0 Thermal – Heat Sinks is made up of a cast aluminium frame that has a total width of 50mm, height of 44mm, and depth of 28mm. This small yet lightweight design makes it very desirable for its use in small-spaced applications. The ATS-50450G-C1-R0 provides a thermal resistance of 0.17°C/W and it requires a fastener to be installed onto it, allowing for the heat dissipation process to take place in a timely manner.

The ATS-50450G-C1-R0 Thermal – Heat Sinks work by transferring and dissipating heat away from the core components of an electronic device. The heat is absorbed by the heatsinks and converted into thermal energy, which is dissipated into the surrounding atmosphere. The thermally conductive metal frame will help to efficiently disperse the heat throughout the system. The process is reliant on having a good amount of thermal resistance that allows the heat to be effectively transferred away from the core components. This thermal resistance provided by the ATS-50450G-C1-R0 is excellent and allows for a quick and efficient heat transfer process.

The ATS-50450G-C1-R0 Thermal – Heat Sinks can be used in a variety of applications such as networking equipment, power supplies, medical imaging equipment, servers, and laptop computers. This makes them an ideal choice for a variety of applications where limited space is a concern. The ATS-50450G-C1-R0 is designed to fit in tight spaces and provide a successfully working solution to overcome space restrictions.

The ATS-50450G-C1-R0 Thermal – Heat Sinks offer low power consumption since they work by dissipating heat, rather than actively cooling the core components. This makes them a great choice for applications where energy conservation is important. Additionally, the thermal resistance of the ATS-50450G-C1-R0 ensures that your device will stay cool and running at optimal temperature.

The ATS-50450G-C1-R0 Thermal – Heat Sinks are a reliable and cost-effective solution that can be used in the majority of electronic devices. They provide a quick and efficient way to dissipate excess heat and keep your device running at optimal performance. With its small size and lightweight design, the ATS-50450G-C1-R0 is the perfect choice for applications with limited space.

The specific data is subject to PDF, and the above content is for reference

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