ATS-50450G-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-50450G-C3-R0-ND

Manufacturer Part#:

ATS-50450G-C3-R0

Price: $ 7.56
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK T766
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-50450G-C3-R0 datasheetATS-50450G-C3-R0 Datasheet/PDF
Quantity: 1007
1 +: $ 6.87330
10 +: $ 6.49026
25 +: $ 6.10848
50 +: $ 5.72670
100 +: $ 5.34492
250 +: $ 4.96314
500 +: $ 4.86769
1000 +: $ 4.77225
Stock 1007Can Ship Immediately
$ 7.56
Specifications
Series: maxiGRIP, maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Angled Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.492" (12.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a significant element in electronic designs. Heat sinks have become commonplace to complement the heat generated by high-power devices, and ATS-50450G-C3-R0 is one of those devices. It is a highly efficient heat sink designed for use in low-impedance designs, providing good thermal performance, low profile and small footprint, making it a viable choice for many applications.

ATS-50450G-C3-R0 heat sink\'s application field lies mainly in the field of low impedance applications. These applications require constant heat dissipation. For example, power transistors, ICs, or power amplifiers may all require a certain level of cooling in order to maintain an optimal temperature. ATS-50450G-C3-R0 is specifically designed for this purpose. It offers excellent heat dissipation without occupying substantial space, ensuring all components and boards are kept in good thermal condition.

The working principle of ATS-50450G-C3-R0 is simple, yet effective. The heat sink is made up of a series of aluminum fins that act as a convection path to dissipate heat from its source. Heat is conducted down through the base and up into the fins, transferring it away from the device and dissipating it into the surrounding environment. The more surface area it has, the better its cooling performance. It also features a curved design, which further accelerates heat flow out into the environment.

The unique shape of ATS-50450G-C3-R0 allows it to be used in tight spot cooling or when space is at a premium. The size of this heat sink has been optimally designed to ensure that it fits into almost any space, enabling efficient cooling of restricted area components.

The fins are also designed to be thicker than normal to ensure uniform heat dissipation. This helps to ensure that the entire heat sink provides uniform cooling, instead of only some of the fins heating up faster while the others remain colder. The heat sink also provides good heat dissipation even at higher power levels, making it an ideal choice for applications that require high power or that require cooling in a tighter space.

Furthermore, ATS-50450G-C3-R0 features superior reliability and durability. It is constructed with aluminum, which is a remarkably reliable material that is resistant to corrosion and other environmental factors. This ensures that the heat sink will remain effective in its intended application, offering consistent cooling performance even after its been exposed to harsh environmental conditions.

Overall, ATS-50450G-C3-R0 is an excellent choice for low-impedance design applications. Its curved fins provide excellent heat dissipation, its small size makes it suitable for tight spots, and its aluminum alloy construction gives it enhanced durability and reliability. This makes it a great choice for any application that requires efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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