| Allicdata Part #: | ATS1460-ND |
| Manufacturer Part#: |
ATS-50450P-C3-R0 |
| Price: | $ 8.22 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 45X45X17.5MM T766 |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-50450P-C3-R0 Datasheet/PDF |
| Quantity: | 780 |
| 1 +: | $ 7.46550 |
| 10 +: | $ 7.05285 |
| 25 +: | $ 6.63793 |
| 50 +: | $ 6.22301 |
| 100 +: | $ 5.80816 |
| 250 +: | $ 5.39328 |
| 500 +: | $ 5.28957 |
| 1000 +: | $ 5.18584 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 1.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are device-level components used to dissipate heat generated by electronic components. Heat sinks are commonly used in cooling applications such as CPUs, but can also be used in residential HVAC systems. The ATS-50450P-C3-R0 is a thermal - heat sink designed for use in electronic devices. This article will discuss the application of the ATS-50450P-C3-R0 and its working principle.
The ATS-50450P-C3-R0 is a single-stage, slim-profile heat sink designed for cooling medium-to-high power dissipation applications. It features a large surface area with telescoping fin design which greatly increases the thermal efficiency of this heat sink. This heat sink is designed for use with both air and liquid cooling. The ATS-50450P-C3-R0 is commonly used in computers, servers, networking equipment, power amplifiers, and other electronic devices with high-power profiles.
The ATS-50450P-C3-R0 has been designed to be highly efficient in dissipating heat. It is able to transfer heat at a high rate due to its large surface area, which increases the efficiency of heat dissipation by allowing more air or liquid to cool the device. Additionally, the telescoping fin design increases the overall efficiency of the thermal solution by providing more surface area to dissipate heat. The fins also help increase the surface area of the heat sink, allowing for more efficient heat transfer.
The working principle of the ATS-50450P-C3-R0 is relatively simple. Heat generated by the electronics is conducted through the heat sink, where it is then dispersed into the atmosphere. This is done by either air or liquid cooling. Air cooling is accomplished by allowing air to pass through the fins, while liquid cooling is accomplished by circulating a coolant through the heat sink. The air or liquid cools the electronics, transferring the heat away from them and into the atmosphere.
The ATS-50450P-C3-R0 is an excellent choice for applications where high-power dissipation is required. It is designed to be highly efficient and can be used with either air or liquid cooling. This makes it an ideal choice for any application where thermal management is a priority. With its slim-profile design, the ATS-50450P-C3-R0 is a great choice for applications where space is at a premium.
The specific data is subject to PDF, and the above content is for reference