| Allicdata Part #: | ATS1064-ND |
| Manufacturer Part#: |
ATS-51170K-C1-R0 |
| Price: | $ 6.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 17MM X 17MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51170K-C1-R0 Datasheet/PDF |
| Quantity: | 65 |
| 1 +: | $ 6.31890 |
| 10 +: | $ 6.15069 |
| 25 +: | $ 5.80885 |
| 50 +: | $ 5.46714 |
| 100 +: | $ 5.12543 |
| 250 +: | $ 4.78372 |
| 500 +: | $ 4.44202 |
| 1000 +: | $ 4.35659 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 0.669" (17.00mm) |
| Width: | 0.669" (17.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
.Thermal heat sinks use thermodynamics to facilitate the transfer of heat away from objects, such as CPUs and GPUs. In the case of ATS-51170K-C1-R0 in particular, the application field can be effectively expanded to more efficient heat dissipation.
This thermal heat sink is a top-of-the-line solution developed for heat sinks that feature integrated fins and airflow structure. It is designed to effectively spread the heat from an object, such as a CPU, throughout the fins and cool it down rapidly. The fins enable a greater area on which heat can be dissipated. The fins also make use of airflow produced by air fans to further accelerate heat transfer away from the object. The product\'s high capacity allows it to handle higher power levels than that of simpler heat sinks. Additionally, its reliable construction ensures high durability over time and its superior thermal performance ensures that it works effectively.
Since the ATS-51170K-C1-R0 has several integrated features to aid in heat dissipation, its working principle can be easily used in different application fields. It can be used for cooling both graphics cards as well as CPUs. Furthermore, its tight construction helps it achieve the highest amount of cooling for a wide variety of electronic devices. It is also compatible with a wide variety of CPUs and offers a great amount of thermal performance.
The ATS-51170K-C1-R0 is a great choice for enthusiasts who demand both performance and efficiency. Its superior fins and airflow structure provide an instant boost in thermal performance, allowing heat to dissipate quickly and efficiently. Moreover, its reliable construction ensures that it will not easily fail under heavy loads, making it great for overclocking and intense gaming sessions. As a result, users can enjoy their systems for longer periods of time without the worry of thermal failure. Furthermore, its small size means it can be easily integrated into systems, making it a great choice for those who want to maximize their performance and cooling while still having a small footprint.
At its core, the ATS-51170K-C1-R0 is a great choice for those looking for an effective thermal solution. Its fins and airflow structure allow for maximum dissipation, its construction ensures reliability, and its small size means it can be easily integrated into modern systems. All of these benefits make it a great choice for enthusiasts looking for a reliable thermal solution for their PC.
The specific data is subject to PDF, and the above content is for reference