| Allicdata Part #: | ATS1080-ND |
| Manufacturer Part#: |
ATS-51170R-C1-R0 |
| Price: | $ 7.55 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 17MM X 17MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51170R-C1-R0 Datasheet/PDF |
| Quantity: | 294 |
| 1 +: | $ 6.86070 |
| 10 +: | $ 6.67737 |
| 25 +: | $ 6.30630 |
| 50 +: | $ 5.93536 |
| 100 +: | $ 5.56448 |
| 250 +: | $ 5.19350 |
| 500 +: | $ 4.82252 |
| 1000 +: | $ 4.72977 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 0.669" (17.00mm) |
| Width: | 0.669" (17.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal – Heat Sinks are a component employed in the technology of thermomatic systems, used for the purpose of controlling a range of temperatures. The ATS-51170R-C1-R0, specifically, is a generic thermal semi-conductor notched for easy installation in thermal systems. It is designed specifically for the purpose of providing high-efficiency, low power dissipations and low thermal resistance.
The ATS-51170R-C1-R0 is a specialized thermal heat sink primarily employed in the application of power semiconductor and other devices requiring cooling. It is applicable across a range of electrical and electronic devices needing such a component, including transistors, power amplifiers and other heat sensitive devices which require cooling and stable heat performance.
The ATS-51170R-C1-R0 is designed to provide high-efficiency dissipation and low thermal resistance. The device is constructed from pressed metal cutouts, which have been soldered in place, and fitted with a corrosion resistant coating for maximum heat transfer. The design also minimizes mass, allowing for greater efficiency and lighter weight.
The ATS-51170R-C1-R0 works by passively transferring heat away from the source via conduction. The device is designed to create an internal thermal space where air can circulate to better conduct heat away from the source. The device also features fins, which act as heat spreaders, extending the area available for heat to be conducted away from the source.
The ATS-51170R-C1-R0 features an extended fin length, giving it a higher dissipative capacity than other similar size heat sinks. The device also has a larger thermal conductivity making it more suitable for high power applications, such as high power audio amplifiers and transportation ventilation systems. It also features a unique clip on clamp, designed to securely fit onto the component needing cooling, making installation fast and simple.
Overall, the ATS-51170R-C1-R0 is a specialized Thermal Heat Sink designed for the purpose of cooling and providing stable heat performance in high-power applications. The device is lightweight and features a corrosion resistant coating with a larger thermal conductivity making it highly suitable for a range of electrical and electronic devices needing cooling, such as transistors and power amplifiers. The device features a unique clip on clamp and extended fins to ensure maximum dissipating power.
The specific data is subject to PDF, and the above content is for reference