ATS-51190D-C1-R0

Series:	maxiGRIP, maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Clip, Thermal Material
Shape:	Square, Angled Fins
Length:	0.748" (19.00mm)
Width:	0.748" (19.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	16.70°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks

Heat sinks are commonly used in a variety of applications, from consumer electronics to industrial machinery. The ATS-51190D-C1-R0 is a significant advancement in thermal management. This device combines the latest innovations in materials and manufacturing processes to provide superior heat dissipation for large, high-powered electronic systems.

Materials

The ATS-51190D-C1-R0 is constructed of a low-carbon, aluminum alloy. This alloy is made up of its own specific composition of aluminum, copper, magnesium, and iron. This combination of metals allows the device to offer high conductivity, while still maintaining its weight and structural integrity. Additionally, the ATS-51190D-C1-R0 is coated with an electro-chemically applied black anodized finish, which adds additional protection from wear and tear.

Design

The design of the ATS-51190D-C1-R0 is also a major factor in its success. It features a pair of convex fins at the top of the heat sink that serve to force the air down through the fins and out the bottom. This pushes the heated air away from the component and helps to dissipate the heat more efficiently. The fins also offer superior air turbulence, which helps to promote maximum heat transfer. Additionally, the ATS-51190D-C1-R0 features a combination of round and square-shaped fins, which further enhances its performance.

Application Field

The ATS-51190D-C1-R0 is most commonly used in applications that require a large amount of heat dissipation. These applications include servers, storage devices, telecommunications electronics, and industrial equipment. Additionally, the device is also suitable for the cooling of network switch gear, power supplies, power electronic devices, compute boards and CPUs, and other electronics.

Working Principle

The working principle of the ATS-51190D-C1-R0 lies in its combination of materials and design. The combination of aluminum, copper, magnesium, and iron allows for optimal heat transfer from the component to the fins of the heat sink, while the fins promote optimal air turbulence for maximum heat dissipation. Additionally, the convex fins force the heated air away from the component for more efficient cooling. In this way, the ATS-51190D-C1-R0 is able to efficiently cool large, high-powered components.

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