ATS-51210K-C1-R0

Thermal - Heat Sinks are usually used in very temperature sensitive applications where the temperature of the environment needs to be controlled. The ATS-51210K-C1-R0 is a 10W T.C. 40x40x1.5 mm Heat Sink designed to provide thermal control in a wide variety of applications. The heat sink is designed to dissipate heat from any component on the board, with a maximum reflow temperature of 260°C.

The ATS-51210K-C1-R0 heat sink is designed with a number of features that make it suitable for a variety of applications. It has a high power density rating of 10W, enabling it to dissipate heat quickly and efficiently in high temperature environments. The sink is also equipped with a radial fin that can be adjusted to provide optimal thermal coverage.

The heat sink is designed to be mounted directly onto the component, eliminating the need for mounting hardware and eliminating the risk of creating thermal hotspots or poor heat dissipation. The mounting hole design of the heat sink also allows for easy installation and removal. Finally, the heat sink is designed to provide excellent thermal performance in temperature sensitive applications.

The ATS-51210K-C1-R0 thermal heat sink is based on a standard finned design which provides excellent heat dissipation performance. The fin extending from the bottom of the case elevates the board off the case and provides a layer of raised fins that act as heat pipes. This layer of thermal fins increases the surface area available for heat dissipation, maximizing the performance of the heat sink.

The raised fins act to accelerate heat dissipation by using the air flow between the fins to help transfer the heat away. The raised fins also help prevent the thermal resistance from increasing due to contact from the surrounding areas of the component. The large surface area provided by the raised fins effectively increases the amount of heat dissipated from the component and can be further improved by increasing fan speed or airflow.

In addition to the air-flow system, the ATS-51210K-C1-R0 thermal heat sink is also designed with a number of features to help maximize heat dissipation. It is equipped with a thermal pad on the bottom of the unit, which helps to promote direct heat transfer between the sink and the component. The pads are made from high-quality aluminum, improving heat transfer and reducing the thermal resistance caused by air pockets in between the pad and the component.

In order to improve the heat dissipation performance of the heat sink, the ATS-51210K-C1-R0 also features a number of additional components. The heat sink is equipped with a high performance copper slug which aids in thermal transfer and helps to improve heat dissipation. Additionally, the sink also has a thermal baffle which helps to shape the air flow and helps to ensure that the entire component is cooled.

The ATS-51210K-C1-R0 was designed to provide a versatile heat dissipation solution for a variety of applications. It is suitable for high temperature environments, providing excellent thermal performance for both air-flow and passive cooling systems. The high power density rating and fin design enable the ATS-51210K-C1-R0 to dissipate heat quickly and efficiently, making it an ideal choice for temperature sensitive applications.