| Allicdata Part #: | ATS1083-ND |
| Manufacturer Part#: |
ATS-51230R-C1-R0 |
| Price: | $ 7.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 23MM X 23MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51230R-C1-R0 Datasheet/PDF |
| Quantity: | 449 |
| 1 +: | $ 7.05600 |
| 10 +: | $ 6.66351 |
| 25 +: | $ 6.27178 |
| 50 +: | $ 5.87979 |
| 100 +: | $ 5.48780 |
| 250 +: | $ 5.09582 |
| 500 +: | $ 4.99783 |
| 1000 +: | $ 4.89983 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-51230R-C1-R0 is a thermal - heatsink that is commonly used in many electronic application fields. It is a low-profile, high-efficiency, and cost-effective heatsink designed for use in consumer and industrial applications.
The ATS-51230R-C1-R0 heatsink is constructed using a single aluminum fin stacked along an internal terminal that dissipates heat from the device. The height of the fin stack is 4.6mm and features a variable number of fins and thickne of the fin depending on the requirements. This heatsink can effectively remove up to 3.1 Watts of heat from its mounted device.
This product is designed with an L-shape design and its low profile system allows it to fit within a minimal space while dissipating heat more efficiently. It is designed to be robust, yet lightweight, and can improve the efficiency of system cooling by up to 25 percent, which makes it very suitable in applications where space is limited. Furthermore, its design minimizes air entrapment, which reduces thermal resistance.
The ATS-51230R-C1-R0 has a thermal resistance of 0.68 degrees Celsius (°C) per Watt (W) when used with additional stacked aluminum fins, this number drops to 0.38 °C/W. This low thermal resistance droops the junction temperature of the device providing it optimum performance and greater reliability.
The ATS-51230R-C1-R0 is designed with a thermal pad for thermal interface material which makes the installation effortless. This one-piece design is made to fit any conventional pc board, offers flexibility for mounting. Furthermore, this product is available in a variety of finishes with various mounting configurations.
In conclusion, the ATS-51230R-C1-R0 is an excellent choice for a thermal - heatsink with many features which have made it one of the most popular choices. Its small footprint provides maximum space savings, its thermal performance is excellent, and it is easy and effortless to install. This product is perfect for applications such as embedded computers, industrial and consumer electronic devices, and telecommunications equipment.
The specific data is subject to PDF, and the above content is for reference