ATS-51250D-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1052-ND

Manufacturer Part#:

ATS-51250D-C1-R0

Price: $ 6.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 25MM X 25MM X 9.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-51250D-C1-R0 datasheetATS-51250D-C1-R0 Datasheet/PDF
Quantity: 53
1 +: $ 6.19290
10 +: $ 6.02469
25 +: $ 5.68991
50 +: $ 5.35513
100 +: $ 5.02041
250 +: $ 4.68572
500 +: $ 4.35102
1000 +: $ 4.26735
Stock 53Can Ship Immediately
$ 6.81
Specifications
Series: maxiGRIP, maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Angled Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

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Thermal – Heat Sinks are important components in many machines and devices. The thermal energy generated as a result of the machine’s operations must be dissipated to maintain safe operating temperatures and prevent breakdowns and malfunctions. This is often done with the use of heat sinks that act as long, large surfaces to spread the heat and transfer it away from the device.

One such type of heat sink is the ATS-51250D-C1-R0 which is often used in industrial purposes and in medical applications. The ATS-51250D-C1-R0 is a 5-phase, 50mm square profile heat sink. It is primarily constructed from aluminum with a black anodized finish. The heat sink incorporates advanced fin geometry to maximize air flow and heat dissipation, which is a crucial factor in many applications.

The ATS-51250D-C1-R0 heat sink is designed to efficiently dissipate up to 52W of thermal energy passively. That is, without active or auxiliary fans. The combination of fin geometry and high thermal conductivity aluminum ensures that, despite having a small and compact profile, the ATS-51250D-C1-R0 provides a maximum cooling potential. This makes the ATS-51250D-C1-R0 highly suitable for small and enclosed environments where space is a premium but efficient thermal management is still essential.

The functioning of the ATS-51250D-C1-R0 heat sink is relatively straightforward. The heat source, such as a processor or motor, is connected to the heat sink via a thermally conductive interface. This means that heat is transferred from the heat source to the surface of the heat sink, at which point it can be dissipated via the air flow through the fins.

The heat sink features high performance cooling fins that are metal die cast to provide a continuous surface. This eliminates the thermal resistance generated by typical air-gap type heatsinks. The metal used is also precision machined for optimal fabrication, allowing for an even surface with no imperfections or obstructions that could inhibit heat dissipation.

The ATS-51250D-C1-R0 heat sink is also designed with an innovative fin design which increases its overall surface area, allowing for better heat dissipation. The fins are arranged in a diamond pattern on the back of the heat sink, which is designed to maximise air flow and increase the surface area exposed to the outside air. This means that more heat is able to be dissipated away from the heat source, providing excellent heat management with no additional fan.

The ATS-51250D-C1-R0 heat sink is a reliable and effective way to manage and dissipate the thermal energy generated in a variety of applications. It is ideally suited for industrial purposes, medical applications, as well as applications that are limited on space. Its advanced fin geometry, high thermal conductivity, and optimal fabrication ensure that it can dissipate up to 52W of energy, passively, while maintaining a compact profile.

The specific data is subject to PDF, and the above content is for reference

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