| Allicdata Part #: | ATS1068-ND |
| Manufacturer Part#: |
ATS-51250K-C1-R0 |
| Price: | $ 7.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 25MM X 25MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51250K-C1-R0 Datasheet/PDF |
| Quantity: | 558 |
| 1 +: | $ 6.70950 |
| 10 +: | $ 6.52869 |
| 25 +: | $ 6.16568 |
| 50 +: | $ 5.80306 |
| 100 +: | $ 5.44036 |
| 250 +: | $ 5.07767 |
| 500 +: | $ 4.71498 |
| 1000 +: | $ 4.62431 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal Heat Sinks are an essential part of modern electronics. They provide the essential cooling needed to enable electronic components to operate at their fullest potential. As such they are an important factor in the longevity and performance of devices.
The ATS-51250K-C1-R0 is a thermal heat sink which is designed for a variety of applications. It is manufactured from high quality aluminum and provides excellent thermal performance. The device features excellent thermal resistance, good power handling and low noise. It is designed to work over a wide range of temperature conditions, and is suitable for a variety of applications.
The ATS-51250K-C1-R0 is most commonly used in electronic cooling applications. The device is capable of dissipating between 0.35 and 4 watts of heat, depending on the application. This makes it suitable for a variety of applications, such as consumer electronics, power supplies, and even military and aerospace applications. It also works well in applications such as HVAC systems.
The ATS-51250K-C1-R0 features a unique design which is optimized for maximum thermal performance. It has a high conductivity copper base and aluminum fins which increase the surface area in direct contact with the air. This configuration ensures that the heat generated by the electronic components is quickly spread over the surface of the heat sink. The aluminum fins also provide a large area for heat to be dissipated, allowing for faster cooling.
The ATS-51250K-C1-R0 uses a thermal management process that works on an active and passive level. The active level involves the use of fans, liquid cooling, and other mechanisms to actively move air and cool the device. The passive level involves using a heat sink and other methods to passively spread and dissipate the heat that is generated. This allows the device to remain cooler and dissipate heat more effectively.
In order to ensure that the ATS-51250K-C1-R0 is operating at its optimal performance, it is important to follow the appropriate installation instructions. Proper installation is key to ensuring that the device will attain its intended performance level. The device should be placed in an area where it is able to take in a significant amount of airflow, and should not be placed against any obstructions or walls.
The ATS-51250K-C1-R0 is an ideal solution for a wide range of electronic cooling applications. It has a unique design that allows it to provide excellent thermal performance, good power handling, and low noise. It is also able to provide a wide range of thermal management processes, and is easy to install and maintain. It is the perfect choice for any application that requires efficient cooling and long-term reliability.
The specific data is subject to PDF, and the above content is for reference