Series:	maxiGRIP, maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Clip, Thermal Material
Shape:	Square, Angled Fins
Length:	1.063" (27.00mm)
Width:	1.063" (27.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Thermal - Heat Sinks

Heat sinks are essential components in many thermal management systems as they provide the thermal path necessary to dissipate the heat generated by the device to the surrounding environment. The ATS-51270D-C1-R0 is an extreme-performance heat sink from Advanced Thermal Solutions, Inc. (ATS) that is designed to reduce the operating temperatures of devices with high power levels and thermal requirements. This article will discuss the application of the ATS-51270D-C1-R0 as well as its operating principle and use.

Application of the ATS-51270D-C1-R0

The ATS-51270D-C1-R0 is a highly efficient heat sink that is capable of dissipating up to 450W of power with a thermal resistance of 0.5°C/W. It is ideal for use in applications such as power amplifiers, high power lasers, CPU cooling, and LED displays. The thermal resistance can be further improved by adding a fan or increasing the airflow over the surface of the heat sink.

Working Principle

The ATS-51270D-C1-R0 works by dissipating the heat generated by the device into the surrounding environment. The heat is transferred from the source to the heat sink through conduction. Once the heat is transferred to the heat sink, it is removed from the system through convection. The heat is transferred from the surface of the heat sink to the surrounding air, thus reducing the temperature of the source device.

Heat Sink Use

The ATS-51270D-C1-R0 is typically used in conjunction with a cooling fan for increased efficiency. The fan can be placed directly over the heat sink, or it can be placed in the vicinity of the heat sink to draw in additional cool air. Alternatively, a fanless solution may be employed. In this case, natural convective airflow is used to dissipate the heat from the system.

Conclusion

The ATS-51270D-C1-R0 is a high-performance heat sink designed to reduce the operating temperatures of devices with high power levels and thermal requirements. Its application is wide-ranging and can be used in a variety of applications such as power amplifiers, high power lasers, CPU cooling, and LED displays. The heat sink is typically used in conjunction with a cooling fan, or in fanless mode with natural convective airflow being used to remove the heat.

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