Allicdata Part #: | ATS1085-ND |
Manufacturer Part#: |
ATS-51270R-C1-R0 |
Price: | $ 7.92 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEAT SINK 27MM X 27MM X 19.5MM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-51270R-C1-R0 Datasheet/PDF |
Quantity: | 766 |
1 +: | $ 7.20720 |
10 +: | $ 6.80400 |
25 +: | $ 6.40382 |
50 +: | $ 6.00352 |
100 +: | $ 5.60328 |
250 +: | $ 5.20302 |
500 +: | $ 5.10296 |
1000 +: | $ 5.00291 |
Series: | maxiGRIP, maxiFLOW |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip, Thermal Material |
Shape: | Square, Angled Fins |
Length: | 1.063" (27.00mm) |
Width: | 1.063" (27.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.768" (19.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
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Thermal heat sinks are an integral part of a system’s cooling system. A thermal heat sink is a passive heat disperser, designed to absorb excess heat from a system’s components, preventing them from getting too hot and consequently breaking or failing. The ATS-51270R-C1-R0 is a heat sink designed for use in industrial environments. It has a compact design and is designed to dissipate up to 35W.
The ATS-51270R-C1-R0 is designed with special features that make it suitable for industrial use. The heat sink utilizes a combination of heat pipes and fins to dissipate the excess heat. The heat pipes create a connection between the heat sink and the heat source, and the fins provide an increased surface area for heat dissipation. The heat pipes in particular are designed to provide efficient cooling performance, even in a small form factor. The heat sink also features a unique fanless construction, which eliminates noise and vibration. This makes the unit quieter and more efficient than traditional fan-cooled heat sinks.
The ATS-51270R-C1-R0 is a multi-purpose heat sink that can be used in a variety of applications. It is designed to cool high-performance processors, such as Intel® Xeon® Scalable Processors, as well as graphics cards and other components. It is also suitable for use with multiple processors, as it can provide sufficient cooling for up to four individual processors. The heat sink is also suitable for use in high-end gaming systems, which require high-performance cooling solutions.
In addition to its passive cooling capabilities, the ATS-51270R-C1-R0 is also equipped with an active cooling feature. It is equipped with a fan stand, allowing the user to mount a fan to the heat sink. This feature enables the heat sink to provide more powerful cooling performance, as the fan draws air from the center of the heat sink and disperses it outside. This helps the heat sink to dissipate heat more quickly and effectively.
The ATS-51270R-C1-R0 is designed for easy installation and requires minimal assembly. It comes with all the necessary mounting hardware, allowing the user to quickly and easily install it on their system. The heat sink is also designed to fit a variety of motherboards, making it highly compatible with most systems. Once installed, the user can adjust the fan speed to maximize the cooling performance.
The ATS-51270R-C1-R0 is an important part of an effective cooling system, as it helps to keep components cool and prevent them from failing due to excess heat. Its combination of heat pipes and fins, plus its active cooling feature, make it highly suitable for use in a variety of applications, such as high-performance CPUs, gaming systems, and other components. It is also easy to install and highly compatible with most systems.
The specific data is subject to PDF, and the above content is for reference