Allicdata Part #: | ATS1054-ND |
Manufacturer Part#: |
ATS-51290D-C1-R0 |
Price: | $ 7.04 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEAT SINK 29MM X 29MM X 9.5MM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-51290D-C1-R0 Datasheet/PDF |
Quantity: | 177 |
1 +: | $ 6.39450 |
10 +: | $ 6.21936 |
25 +: | $ 5.87362 |
50 +: | $ 5.52812 |
100 +: | $ 5.18269 |
250 +: | $ 4.83717 |
500 +: | $ 4.49165 |
1000 +: | $ 4.40526 |
Series: | maxiGRIP, maxiFLOW |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip, Thermal Material |
Shape: | Square, Angled Fins |
Length: | 1.142" (29.00mm) |
Width: | 1.142" (29.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.374" (9.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat Sinks involve an array of applications that transfer heat away from components and systems and into a surrounding medium. This prevents the possibility of components and systems becoming too hot and thus malfunctioning. ATS-51290D-C1-R0 is a thermal-heat sink consisting of many features and properties that allow it to dissipate heat more efficiently than traditional heat sinks.
The ATS-51290D-C1-R0 is specifically designed to provide an economical approach to the transfer of heat away from components and systems. It features many peculiar properties that make it an ideal heat sink for a variety of applications. For one, it is constructed from high quality aluminum alloys that can withstand high temperatures and has an anodized finished which increases its lifespan. Additionally, it has greater thermal conductivity compared to other materials, allowing for better heat transfer.
As for its structure, the ATS-51290D-C1-R0 features a unique design that enhances its heat dissipation capabilities. It has an array of specially designed fins that increase the surface area and maximize the rate at which heat can be dissipated into the surrounding environment. Additionally, the fins are designed with high performance gap flow technology that reduces air resistance and improves cooling efficiency. The ATS-51290D-C1-R0 also features a unique fin pitch that makes it possible to dissipate heat into the surrounding environment more quickly.
The ATS-51290D-C1-R0 has a variety of applications and working principles. It can be used to cool down components in both industrial and commercial settings, in addition to being applied in the automotive, mining, communication, medical, and consumer electronics industries. Additionally, it can be used to cool down systems such as CPUs, video cards, power supplies, and other components that require heat dissipation. It can also be used for cooling down thermoelectric and electronic circuitry and components.
The working principle of the ATS-51290D-C1-R0 involves drawing heat from its source component and dissipating it into the surrounding environment. When the component is active, the heat generated is absorbed by the heat sink and then transferred to the fins where it is dissipated into the surrounding environment. This process continues until the component has cooled down and its temperature returns to a functional level.
The ATS-51290D-C1-R0 is a highly effective thermal-heat sink that is well-suited for a variety of applications. Its specialized structure and design allow for superior heat dissipation capabilities that can be used in a variety of industries to ensure components and systems run at optimal temperatures.
The specific data is subject to PDF, and the above content is for reference