| Allicdata Part #: | ATS1086-ND |
| Manufacturer Part#: |
ATS-51290R-C1-R0 |
| Price: | $ 8.04 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 29MM X 29MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51290R-C1-R0 Datasheet/PDF |
| Quantity: | 470 |
| 1 +: | $ 7.30800 |
| 10 +: | $ 6.90102 |
| 25 +: | $ 6.49530 |
| 50 +: | $ 6.08945 |
| 100 +: | $ 5.68342 |
| 250 +: | $ 5.27748 |
| 500 +: | $ 5.17598 |
| 1000 +: | $ 5.07450 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management devices are one of the most common applications that require efficient heat movement from one source to another. Heat sink devices are some of the most common thermal management solutions used in a variety of applications. The ATS-51290R-C1-R0 by Alpha & Omega Semiconductor is a highly efficient heat sink that can be applied to various applications. This article will explore the application field and working principle of the ATS-51290R-C1-R0.
The ATS-51290R-C1-R0 is classified as a radial fin type heat sink, which means that it provides maximum heat dissipation by enlarging the contact area between the heat sink and air. It is made of aluminum, a highly efficient cooling material. The device is also used in applications that require a more efficient cooling than traditional conduction-based cooling. Its unique radial fin design increases the contact area between the air and the heatsink, thus promoting a higher heat transfer rate than other types of heat sinks.
The ATS-51290R-C1-R0 is designed for a wide range of applications including power electronics, consumer electronics, medical equipment, telecommunications, and automotive. In consumer electronics applications, the device is ideal for dissipating the heat generated by the components such as CPUs, GPUs, and other electronic components. In medical equipment, the device can be used to regulate the temperature within devices such as x-ray machines and magnetic resonance imaging devices. In other applications, such as automotive and telecommunications, the device can be used to dissipate the heat generated by power transistors, integrated circuits, and microcontrollers.
The working principle of the ATS-51290R-C1-R0 is relatively simple. It utilizes the natural effect of air convection to draw heat away from sensitive components. As hot air rises and is replaced by cooler air, the ATS-51290R-C1-R0 increases the surface area of the heat spreader, allowing it to dissipate the heat faster. This in turn helps keep sensitive components cooler and more reliable.
The ATS-51290R-C1-R0 is a highly efficient and reliable heat sink designed to regulate temperatures in power electronics, consumer electronics, medical equipment, and other applications. With its innovative radial fin design, the device is capable of providing increased contact area between air and heatsink, leading to superior heat transfer compared to other types of heat sinks. By utilizing the natural process of convection, the ATS-51290R-C1-R0 helps keep components cool and reliable. Therefore, it is an ideal choice for addressing thermal management needs in a variety of applications.
The specific data is subject to PDF, and the above content is for reference