| Allicdata Part #: | ATS1055-ND |
| Manufacturer Part#: |
ATS-51300D-C1-R0 |
| Price: | $ 7.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 30MM X 30MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51300D-C1-R0 Datasheet/PDF |
| Quantity: | 96 |
| 1 +: | $ 6.45120 |
| 10 +: | $ 6.27669 |
| 25 +: | $ 5.92780 |
| 50 +: | $ 5.57903 |
| 100 +: | $ 5.23039 |
| 250 +: | $ 4.88169 |
| 500 +: | $ 4.53300 |
| 1000 +: | $ 4.44583 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal applications have become increasingly important as modern electronic products require more and more reliable performance. It is therefore critical that heat dissipation is conducted properly. Heat sinks are an integral part of most thermal applications, as they are specifically designed to transfer and dissipate heat away from important components. The ATS-51300D-C1-R0 heat sink belongs to this category, and is suitable for a range of applications.
The ATS-51300D-C1-R0 heat sink is a highly efficient heat transfer device. It is made from a high grade extruded aircraft grade aluminum, which is then anodized for further protection against corrosion. The heat sink fins are also treated for greater thermal regulation capabilities. The most important feature of this heat sink is its highly efficient cooling system, which is designed to ensure maximum heat dissipation and long life.
The ATS-51300D-C1-R0 heat sink has been designed to be used in a wide range of applications. It is an ideal choice for high power, surface mount integrated circuits, as well as in other electronics such as LED lighting and even medical and instrumentation applications. The device helps to ensure that components are kept at appropriate temperatures while also protecting them from physical damage. This is achieved through the efficient air-flow pattern created by the extra-tall, segmented fins which efficiently dissipate heat away from the components.
The ATS-51300D-C1-R0 also features a unique thermal interface material (TIM) which helps to transfer heat from the device to the heat sink. The TIM is designed to be highly elastic, and has good thermal stability and resistance to thermal cycling. Moreover, the TIM is able to conform to irregular shapes and surface profiles, further facilitating the efficiency of the heat transfer. The TIM also provides excellent conductivity while also being able to withstand high thermal shock.
The ATS-51300D-C1-R0 heat sink is an incredibly efficient cooling device, and helps to prolong the life of the components and the system as a whole. The TIM which is included helps to ensure that the heat transfer is immediate and effective, while the aluminum fins help to dissipate the heat quickly and effectively. In addition, the unit is designed to run with great efficiency and economy, allowing for long-term use with minimal maintenance costs. This makes it a reliable and cost effective choice for any application requiring reliable thermal regulation.
The specific data is subject to PDF, and the above content is for reference