| Allicdata Part #: | ATS1087-ND |
| Manufacturer Part#: |
ATS-51300R-C1-R0 |
| Price: | $ 8.11 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 30MM X 30MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51300R-C1-R0 Datasheet/PDF |
| Quantity: | 95 |
| 1 +: | $ 7.37730 |
| 10 +: | $ 6.96591 |
| 25 +: | $ 6.55654 |
| 50 +: | $ 6.14666 |
| 100 +: | $ 5.73691 |
| 250 +: | $ 5.32711 |
| 500 +: | $ 5.22467 |
| 1000 +: | $ 5.12222 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-51300R-C1-R0 is a thermal heat sink used for applications involving thermal management and dissipation. Its main purpose is to transfer heat from the surface of a component or device to a source of heat, generally air. It is a reliable and cost-effective solution for many thermal applications. It is used in various industries such as computer, telecommunications and consumer electronics.
The ATS-51300R-C1-R0 thermal heat sink operates on the principle of thermal management. It uses a variety of methods to achieve thermal management. Its main method is heat conduction. Heat conduction involves transferring heat from one source to another, in a relatively uniform manner. Heat from a component or device is transferred to the air around it by means of a heat pipe or other conductor, such as fins on the heat sink.
The heat sink also makes use of other thermal management techniques, such as convection and radiation. Convection is the movement of heat through the air around the heat sink, while radiation is the transfer of heat energy as waves. Both of these techniques can help increase the rate of heat transfer from the surface of the component or device to the heat sink.
The heat sink also includes various features to ensure efficient cooling performance. It is designed to maximize surface area for improved heat transfer, and provide maximum airflow to keep components and devices cool. Additionally, the heat sink is constructed from high-quality materials for durability and corrosion resistance. It has a built-in heat dissipation fan to provide maximum cooling capacity.
The ATS-51300R-C1-R0 thermal heat sink is designed for maximum efficiency, reliability, and cost-effectiveness. It is suitable for a wide variety of applications, including industrial, commercial, and consumer electronics. It is easy to install and can be used in both indoor and outdoor settings. With its high quality construction and efficient cooling performance, the ATS-51300R-C1-R0 is a reliable and cost-effective solution for many thermal management needs.
The specific data is subject to PDF, and the above content is for reference