ATS-51310R-C1-R0

Series:	maxiGRIP, maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Clip, Thermal Material
Shape:	Square, Angled Fins
Length:	1.220" (30.99mm)
Width:	1.220" (30.99mm)
Diameter:	--
Height Off Base (Height of Fin):	0.768" (19.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.20°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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Introduction

Thermal-Heat Sinks are a type of heat dissipation device used to cool electronic components and devices. They feature a metal construction that transfers thermal energy away from the overheated component through the natural process of thermal conductivity. The ATS-51310R-C1-R0 is a Thermal-Heat Sink based on this technology, designed to meet the needs of a wide range of customers and applications. This article will discuss the application fields and working principles related to the ATS-51310R-C1-R0.

Application Fields

The ATS-51310R-C1-R0 Thermal-Heat Sink is a great solution for components, devices, and systems that require an efficient cooling system. It provides excellent thermal energy transfer and is suitable for lightweight applications across various industries. Examples of application fields include:

• Mobile phones and tablets
• Televisions, home entertainment systems, and other audio-visual equipment
• Automotive electronic systems and components
• Computers and servers
• Industrial control systems and other electronic systems
• Industrial and medical equipment

The ATS-51310R-C1-R0 is easy to integrate into existing designs, and is ideal for tight spaces and compact systems. It offers excellent performance, while its low thermal resistance ensures fast heat transfer and efficient operation.

Working Principle

The ATS-51310R-C1-R0 is designed to dissipate heat from the surface of the device or component that it is attached to. It does this by using the natural process of thermal transfer, or thermal conductivity, which is the transfer of thermal energy from the warm component to the metal structure of the heat sink. This movement of energy reduces the surface temperature of the component, allowing it to remain in its optimal operating range.The ATS-51310R-C1-R0 features a metal construction that facilitates the efficient transfer of thermal energy away from the component or device. It has a low thermal resistance that allows for maximum heat transfer in a short amount of time, while its compact profile makes it suitable in applications where space is limited. Additionally, its lightweight construction makes it easy to install and integrate into designs.

Conclusion

The ATS-51310R-C1-R0 Thermal-Heat Sink is an efficient, reliable, and lightweight solution for cooling components and devices in a wide range of applications. It uses the natural process of thermal transfer, or thermal conductivity, to move thermal energy from the warm component to the metal heat sink, thus cooling it down. Its low thermal resistance and compact size make it ideal for integration into tight spaces, and its lightweight construction makes it easy to install. This makes the ATS-51310R-C1-R0 an ideal choice for cooling electronic components and devices in various industry settings.

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