| Allicdata Part #: | ATS1057-ND |
| Manufacturer Part#: |
ATS-51325D-C1-R0 |
| Price: | $ 5.96 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 32.5 X 32.5 X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51325D-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 100 +: | $ 5.36892 |
| 300 +: | $ 5.01100 |
| 500 +: | $ 4.65307 |
| 1000 +: | $ 4.56359 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.280" (32.51mm) |
| Width: | 1.280" (32.51mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a vital requirement for today\'s electronic devices, from smart watches, to computers and home automation systems. The ATS-51325D-C1-R0 is a heat sink designed to dissipate heat from devices reliably and efficiently. This heat sink utilizes a stacked fin design to provide maximum surface area for cooling and the latest advancements in aluminum extrusion and ceramic insulating material to maintain optimal operating temperatures.
The ATS-51325D-C1-R0 is a pin-fin heat sink, meaning that the fins are arranged in discrete rows, with vertical staking. This design enables airflow to pass over successive fins and exchange heat more efficiently than other thermal management solutions. The design also helps to create turbulence in the air, improving the transfer rate of heat from the device to the sink.
The ATS-51325D-C1-R0 is designed to dissipate heat generated from higher power integrated circuits (ICs), gate drivers, MOSFETs and rectifiers in the power electronics industry. With the right air flow design, this heat sink can maintain temperatures inside electronic systems to within a safe operational range. The ATS-51325D-C1-R0 also utilizes an advanced aluminum extrusion design that includes a built-in platform which maximizes surface area and air paths for improved thermal conduction. This design and the ceramic insulating material provides industry-leading thermal performance.
The ATS-51325D-C1-R0 is designed as a drop in chamber, so that it can easily be installed into any application without additional modifications or hardware. This feature helps to reduce total assembly cost and also provides for a more efficient and reliable cooling system. Additionally, this feature can provide power savings for applications where cooling is necessary.
With an outstanding thermal performance rating, the ATS-51325D-C1-R0 heat sink is the ideal cooling solution for a variety of application fields. It is suitable for use in household, office, and industrial applications, as well as automotive, aerospace and computer applications.
The ATS-51325D-C1-R0 heat sink is an efficient and reliable thermal management solution for high-power semiconductor devices. Its advanced aluminum extrusion and ceramic insulating material provide superior heat dissipation, while its pre-assembled drop-in design allows for easy integration into any application. This heat sink is the ideal solution for applications in today’s increasingly demanding electronic devices.
The specific data is subject to PDF, and the above content is for reference