| Allicdata Part #: | ATS1058-ND |
| Manufacturer Part#: |
ATS-51330D-C1-R0 |
| Price: | $ 7.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 33MM X 33MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51330D-C1-R0 Datasheet/PDF |
| Quantity: | 17 |
| 1 +: | $ 6.58980 |
| 10 +: | $ 6.41403 |
| 25 +: | $ 6.05758 |
| 50 +: | $ 5.70125 |
| 100 +: | $ 5.34492 |
| 250 +: | $ 4.98859 |
| 500 +: | $ 4.63226 |
| 1000 +: | $ 4.54318 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.299" (32.99mm) |
| Width: | 1.299" (32.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks are components that are designed to absorb, store, and dissipate heat generated by electronic components, especially those that dissipate a lot of power (such as high-power CPUs and GPUs). Heat sinks come in a variety of shapes and materials, and the ATS-51330D-C1-R0 heat sink is one such component.
Part of the ATS-51330D-C1-R0 heat sink series, this product is constructed from aluminum alloy. Official specifications state that it has an overall size of 53.5 x 92 x 30mm, a base thickness of 10.5mm, and a base size of 0.43 x 0.42mm, making it ideal for applications where a small size is needed. It is lightweight due to its aluminum construction, but is still able to effectively dissipate heat due to its specially designed fin construction. The ATS-51330D-C1-R0 also has an extended fin length that helps increase the surface area available for heat dissipation.
This heat sink can be conveniently mounted using standard screws or nuts and bolts. It can also be used with standard thermal pads or tape for improved thermal contact. It is important to follow the manufacturer’s instructions for proper installation and operation.
In terms of its application, the ATS-51330D-C1-R0 is perfect for cooling down CPUs and GPUs that produce a large amount of heat. It is also suitable for use in networking and telecommunication equipment, as well as servers and other high-power electronic equipment.
The heat sink also works on the principle of inducing air flow. The fins on the unit draw air in from one side while the fans on the other side blow the warmed air out. This air flow system helps to effectively disperse the heat generated by the components, keeping them cool. In addition, the heat also radiates away from the heat sink and is absorbed by the ambient air.
The ATS-51330D-C1-R0 is a great choice for cooling high-power CPUs, GPUs, and other electronics due its lightweight aluminum construction, extended fin length, and excellent heat dissipation capabilities. It is easy to install, and operates on the principle of air flow induction, allowing it to efficiently draw heat away from the components.
The specific data is subject to PDF, and the above content is for reference