| Allicdata Part #: | ATS1074-ND |
| Manufacturer Part#: |
ATS-51330K-C1-R0 |
| Price: | $ 7.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 33MM X 33MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51330K-C1-R0 Datasheet/PDF |
| Quantity: | 65 |
| 1 +: | $ 6.95520 |
| 10 +: | $ 6.56586 |
| 25 +: | $ 6.17980 |
| 50 +: | $ 5.79348 |
| 100 +: | $ 5.40729 |
| 250 +: | $ 5.02105 |
| 500 +: | $ 4.92449 |
| 1000 +: | $ 4.82793 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.299" (32.99mm) |
| Width: | 1.299" (32.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal solutions are fundamental for reliable and high-performance in current computers, server, and electrical/electronic equipment. ATS-51330K-C1-R0 is a type of thermal heat sink that is designed to efficiently dissipate heat away from sensitive components in an electronic system. This article will discuss the ATS-51330K-C1-R0’s application field and working principle.
ATS-51330K-C1-R0 is suitable for cooling integrated circuits, power amplifiers, transistors, and high voltage circuits. It is used in a variety of applications including communications, datacenter, power supply and AI accelerators.
The ATS-51330K-C1-R0 is made of copper aluminum, which is able to eliminate two thermal conduction layers between the heat source and heat sink. It has a low profile of 6.2mm, and features a large aluminum extrusion surface area (30mm x 50mm) with multiple channels that make up the fin area. This helps to maximize heat dissipation from the heat source while minimizing heat generation inside the system.
The working principle of ATS-51330K-C1-R0 is based on the fact that heat is drawn away from critical system components through thermal conduction. The heatsink uses an aluminum extrusion fins for thermal conduction, which is highly conductive and has excellent thermal properties. The extruded aluminum fins create a large surface area, which is ideal for transferring heat away from the heat source. The large surface area is also designed to reduce the amount of heat generated inside the system.
The ATS-51330K-C1-R0 also features an adjustable spring clip assembly. This design allows the spring clips to securely attach to processors of different sizes and making adjustments to the mount height without needing to disassemble the heatsink. The adjustable spring enables easier installation and maintenance of the heatsink.
In addition, the ATS-51330K-C1-R0 also includes a thermally conductive gasket that can be inserted between the heatsink and the heat source. This helps to create a strong and reliable interface between the two components, which helps to improve heat transfer and reduce the risk of shorting or burning of the component. The thermally conductive gasket also helps to reduce EMI and eliminate air gaps in the thermal conduction process.
The ATS-51330K-C1-R0 is primarily used for cooling integrated circuits, power amplifiers, transistors, and high voltage circuits. Its adjustable spring clip assembly helps to increase its versatility and reduce the risks of shorting out or burning out components. The large surface area of the aluminum extrusion helps to reduce heat generation and ensure optimal thermal conduction. Finally, the thermally conductive gasket also helps to reduce EMI and eliminate air gaps in the thermal conduction process.
The specific data is subject to PDF, and the above content is for reference