ATS-51375D-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1060-ND

Manufacturer Part#:

ATS-51375D-C1-R0

Price: $ 7.34
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 37.5 X 37.5 X 9.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-51375D-C1-R0 datasheetATS-51375D-C1-R0 Datasheet/PDF
Quantity: 96
1 +: $ 6.67170
10 +: $ 6.49404
25 +: $ 6.13318
50 +: $ 5.77256
100 +: $ 5.41176
250 +: $ 5.05096
500 +: $ 4.69018
1000 +: $ 4.59997
Stock 96Can Ship Immediately
$ 7.34
Specifications
Series: maxiGRIP, maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Angled Fins
Length: 1.476" (37.50mm)
Width: 1.476" (37.50mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.90°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-51375D-C1-R0 is a type of thermal - heat sink designed for many applications. The product is specifically designed to provide optimal thermal performance. It offers a favorable combination of thermal efficiency, low cost, and ease of mounting.

The ATS-51375D-C1-R0 is a heat sink with a fin type design that is suitable for applications such as server, consumer, automotive, industrial, and networking. The heat sink is constructed of premium extruded aluminum and has a unique fin construction that increases turbulence and increases the surface area of the heat sink. This helps to increase the rate of heat dissipation while lower the operating temperature. The heat sink has superb heat transfer characteristics and is able to effectively absorb and disperse heat away from the heat-generating components.

The ATS-51375D-C1-R0 is designed for efficient and reliable operation in a wide range of environmental conditions. It utilizes a proprietary wedge-lock design to ensure secure and reliable mounting of the heat sink to the PCB. The wedge-lock design also prevents vibration caused by the thermal cycling.

The ATS-51375D-C1-R0 offers a high level of performance in a variety of applications. It provides superior thermal performance, low-cost, reliable operation, low-footprint, and easy installability. Its unique fin design helps to increase turbulence and surface area, which in turn improves heat dissipation and lowers the operating temperature. Due to its superior thermal performance and low cost, the ATS-51375D-C1-R0 is an ideal choice for applications that require reliable and efficient heat dissipation.

The working principle of the ATS-51375D-C1-R0 is based on the natural laws of convection and radiation. When heat is generated within the application, it is absorbed by the heat sink and then passed on to the environment by way of convection and radiation. The heat sink helps to dissipate this heat from the application and keeps the application’s operating temperature at a safe, optimal level.

The ATS-51375D-C1-R0 is an extremely effective and efficient thermal - heat sink that is designed for use in many applications. Its unique fin design helps to increase turbulence and surface area, which in turn improves heat dissipation and lowers the operating temperature. It is designed to provide reliable and efficient heat dissipation for a wide range of applications, while also offering a favorable combination of thermal efficiency, low cost, and ease of mounting.

The specific data is subject to PDF, and the above content is for reference

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