| Allicdata Part #: | ATS1076-ND |
| Manufacturer Part#: |
ATS-51375K-C1-R0 |
| Price: | $ 7.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 37.5 X 37.5 X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-51375K-C1-R0 Datasheet/PDF |
| Quantity: | 100 |
| 1 +: | $ 7.04340 |
| 10 +: | $ 6.65280 |
| 25 +: | $ 6.26119 |
| 50 +: | $ 5.86984 |
| 100 +: | $ 5.47854 |
| 250 +: | $ 5.08722 |
| 500 +: | $ 4.98938 |
| 1000 +: | $ 4.89156 |
| Series: | maxiGRIP, maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Angled Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
thermal heat sinks are well known among engineers and scientists alike for their capability of efficiently disposing heat away from any sensitive device or component. One thermal heat sink that stands out from the rest is the ATS-51375K-C1-R0. Below is a comprehensive review of its application field and working principle, to better understand just how this nifty device works.
Application field of ATS-51375K-C1-R0
The ATS-51375K-C1-R0 is a heat sink specifically designed to be used heat producing components such as CPUs, GPUs, FPGAs, and chipset. Its series of fins with its large copper base dissipates heat quickly. Some of its great features include a 3-pin connector or a 4-pin PWM-connector for direct attachment, meaning that it can be used in conjunction with several boards and fan controllers. This makes the ATS-51375HK-C1-R0 especially useable for mini-ITX, ATX and ITX boards.
Due to its versatile design, this compact thermoelectric cooler can be installed on numerous CPUs without much effort. It also supports processors such as Intel Core i7, Intel Xeon, AMD Ryzen, and AMD EPYC.
Working principle of ATS-51375K-C1-R0
The thermal heat sink utilizes a combination of heat diffusion and convection to swiftly cool down components. Heat diffusion occurs when the heat is spread across the heat sink by the thermal transfer material. The sink\'s fins then disperse the heat through convection.
The fan attached to the thermal heat sink plays a major role in moving the heat away from the component. As the surrounding air is drawn into the fan, the hot air coming off the heat sink is pushed away from the component. The fan is then used to capture the hot air and transfer it outside the computer to keep the interior temperature of the hardware from rising.
Conclusion
The ATS-51375K-C1-R0 is a thermal heat sink designed to keep sensitive components cool in a variety of applications. Its sophisticated design combines heat diffusion and convection to dispose of heat and the fan attached to the device boosts its cooling capabilities. If you are looking for an efficient solution to managing heat production from crucial components, the ATS-51375K-C1-R0 is definitely the thermal heat sink you should check out.
The specific data is subject to PDF, and the above content is for reference