ATS-51450R-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1095-ND

Manufacturer Part#:

ATS-51450R-C1-R0

Price: $ 8.65
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 45MM X 45MM X 19.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-51450R-C1-R0 datasheetATS-51450R-C1-R0 Datasheet/PDF
Quantity: 72
1 +: $ 7.85610
10 +: $ 7.42077
25 +: $ 6.98393
50 +: $ 6.54759
100 +: $ 6.11100
250 +: $ 5.67454
500 +: $ 5.56539
1000 +: $ 5.45628
Stock 72Can Ship Immediately
$ 8.65
Specifications
Series: maxiGRIP, maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Angled Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.768" (19.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 1.60°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are essential components in modern electronics that help to dissipate heat generated from electronic components, and to regulate the temperature of a system\'s internal components. The ATS-51450R-C1-R0 is a highly efficient heat sink designed to provide superior performance, enabling reliable operation of electronics in a wide range of environments and temperatures.

This heat sink features a single-piece design that promises excellent performance and durability. The ATS-51450R-C1-R0 is ethylene-propylene-diene monomer (EPDM) coated for increased durability and heat transfer. It also features integrated fins for enhanced heat dissipation, and a modified geometry to reduce components stress.

The ATS-51450R-C1-R0 is designed to be installed directly onto a system’s circuit board or chassis, and can be adjusted to match the thermal impedance requirements of a variety of different electronics components. This heat sink has a wide range of applications, including providing thermal management solutions for industrial computers, medical equipment, and other electronic products.

The ATS-51450R-C1-R0 is designed to use natural convection to cool the system’s components. Heat generated by the components is drawn up and out by air, which is then dissipated away from the system. Heat is naturally drawn away by the air outside of the enclosure, and the fins of the heat sink provide additional surface area for air to be drawn away from the system. This heat transfer process increases the overall efficiency of the system.

In addition to providing superior thermal performance, the ATS-51450R-C1-R0 is designed to be robust and reliable. This heat sink is made out of anodized aluminum, which is both corrosion and oxidation-resistant. It is also designed to withstand shock and vibration, ensuring that the system will continue to function reliably even in extreme conditions.

The ATS-51450R-C1-R0 is also designed to be easy to install and maintain. It requires only minimal assembly, and is designed to offer fast and easy installation into a variety of systems. In addition, the heat sink’s design allows for easy replacement of components in the event of failure.

Overall, the ATS-51450R-C1-R0 is an ideal solution for any system in need of superior thermal performance, reliability, and ease of installation and maintenance. The heat sink provides reliable operation of electronics in a wide range of environments and temperatures, and ensures superior thermal performance. It is an essential component in modern electronics, providing reliable thermal management solutions for a variety of different applications.

The specific data is subject to PDF, and the above content is for reference

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