| Allicdata Part #: | ATS-52150B-C0-R0-ND |
| Manufacturer Part#: |
ATS-52150B-C0-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 15X15X7.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52150B-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Angled Fins |
| Length: | 0.590" (15.00mm) |
| Width: | 0.590" (15.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.295" (7.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions, such as ATS-52150B-C0-R0, an advanced cooling solution for CPUs, are becoming increasingly important for high efficiency systems. As system heat dissipation efforts become more advanced, the implementation of this type of thermal management solution can help to keep the components of the system at the optimal operating range. In this article, we will look at the application field and working principle of ATS-52150B-C0-R0 to better understand how it can benefit system performance.
One of the primary applications of ATS-52150B-C0-R0 is as a cooling solution for CPUs. This thermal management solution is designed to dissipate heat from the CPU and other nearby components while still remaining compact enough to fit discreetly within the system. Its low profile design allows it to be mounted conveniently anywhere in the system, saving valuable space within the system.
The ATS-52150B-C0-R0 thermal management solution is based on the concept of forced air cooling. A fan is used to draw air into the thermal management solution where it is then circulated to cool the components. This type of cooling allows for improved thermal performance and better system stability. The fan is designed to be relatively quiet as well, ensuring that it does not disrupt the operation of the system.
In addition, the ATS-52150B-C0-R0 solution features an optimized heatsink design. This design is designed to maximize heat transfer from the thermal components while still minimizing the overall size of the solution. The heatsink is then covered with a thermal pad which is designed to improve heat dissipation even further. Additionally, the heatsink design also features on-chip temperature sensors which allow for more accurate temperature monitoring.
Overall, the ATS-52150B-C0-R0 cooling solution is an excellent choice for system builders who care about system performance and stability. Its low profile design ensures that it can be mounted conveniently within the system without taking up too much space. In addition, its optimized heatsink design and thermal pad allow it to effectively dissipate heat and keep components at their optimal temperatures. Its enhanced temperature sensors further allow for better system monitoring, allowing users to tweak their system’s settings for optimal performance.
The specific data is subject to PDF, and the above content is for reference