| Allicdata Part #: | ATS-52150G-C0-R0-ND |
| Manufacturer Part#: |
ATS-52150G-C0-R0 |
| Price: | $ 4.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 15X15X12.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52150G-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.35204 |
| 30 +: | $ 4.11054 |
| 50 +: | $ 3.86870 |
| 100 +: | $ 3.62691 |
| 250 +: | $ 3.38512 |
| 500 +: | $ 3.14332 |
| 1000 +: | $ 3.08287 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Angled Fins |
| Length: | 0.590" (15.00mm) |
| Width: | 0.590" (15.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are components used to absorb or dissipate thermal energy from a device or structure. ATS-52150G-C0-R0 is an efficient thermal – heat sink, designed to provide cooling to electronic or electrical components.
ATS-52150G-C0-R0 is a low profile and large size thermal – heat sink. It is composed of a copper base and an aluminum finned extended surface structure. This multi-pronged design provides efficient heat transfer from electronic and electrical components into the fins. The large fin area allows for a greater heat dissipation over a larger area. The heat is then quickly dissipated into the surrounding air.
The ATS-52150G-C0-R0 thermal – heat sink is suitable for a variety of applications. It can be used to cool CPUs, GPUs, amplifiers, and other various electronic and electrical components. The design of the heat sink enables effective cooling with minimal amount of noise and vibration. The copper base provides a steady and efficient heat transfer with lower thermal resistance than traditional aluminum heat sinks - this is one of the key benefits of the ATS-52150G-C0-R0 model.
The ATS-52150G-C0-R0 also provides a low thermal profile when used in larger systems. This allows for better thermal management with minimal power consumption. This makes it ideal for thin and low profile systems that require efficient thermal management and low power consumption.
The working principle of the ATS-52150G-C0-R0 is relatively simple. The heat generated from electronic and electrical components is absorbed by the heat sink’s copper base. This heat is then transferred to the aluminum finned structure, which dissipates it into the surrounding air. This process provides a constant and effective cooling effect to the components.
The ATS-52150G-C0-R0 is an efficient and reliable solution for any cooling and thermal management needs. It’s simple design and low profile offers a great option for many applications. This thermal – heat sink provides reliable cooling for various electronics and electrical components. It is also an ideal choice for use in thin and low profile systems.
The specific data is subject to PDF, and the above content is for reference