ATS-52150G-C1-R0

Series:	maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Angled Fins
Length:	0.590" (15.00mm)
Width:	0.590" (15.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.492" (12.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.70°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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< p>Thermal management products are becoming increasingly important as the demand for higher performance electronic equipment increases. The ATS-52150G-C1-R0 thermal product is designed for applications where high temperature stability is required. It is a type of thermal heat sink designed to provide the thermal and electrical dissipation necessary for high-performance electronic and optical equipment.< /p>< p>The ATS-52150G-C1-R0 heat sink provides a high quality heat transfer solution. It is constructed from a combination of aluminum and copper to ensure maximum thermal performance. The aluminum heat sink is designed to dissipate the heat generated by electronic components at high temperatures and the copper dissipates heat as quickly as possible, providing a low thermal resistance. This combination of materials provides a higher thermal conductivity, allowing the heat to be quickly and efficiently diffused from the heat source to the external environment.< /p>< p>The ATS-52150G-C1-R0 heat sink consists of a base, fins, and supports. The fins are attached to the base and are designed to increase the surface area available for heat dissipation. The fins can also be shaped in different ways to provide better air flow and heat dissipation. The supports provide support for the heat sink and help to keep it in place. < p>The ATS-52150G-C1-R0 heat sink is designed to dissipate heat efficiently and quickly. It has the ability to maintain high temperature stability and reduce radiation losses. The heat sink also offers excellent thermal characteristics, allowing it to be used in high performance applications and provide reliable performance. It also has a low cost and is easy to install.< /p>< p>The ATS-52150G-C1-R0 heat sink has a wide range of applications. It can be used in a variety of electronic and optical equipment, including computer systems, networking devices, and laser systems. It is also commonly used in industrial, automotive, and medical applications as well as in consumer electronics for thermal management.< /p>< p>The ATS-52150G-C1-R0 heat sink is an ideal choice for high performance thermal and electrical applications. It is a highly reliable and efficient heat sink that provides excellent thermal performance. It is designed to provide optimal performance in high temperature and electrical applications and is a cost effective solution for high performance thermal management. With its wide range of applications and low cost, the ATS-52150G-C1-R0 thermal product is an ideal choice for thermal management needs.

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