ATS-52170B-C1-R0

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Thermal management solutions are paramount for electronic devices, as heat increases their temperature beyond their rated specifications, reducing their performance and even causing damage or failure. The ATS-52170B-C1-R0 is a sleveless aluminum heat sink that\'s made to cool down electronic parts, ensuring their longevity and stability.

Overview of the ATS-52170B-C1-R0 Heat Sink

The ATS-52170B-C1-R0 heat sink, designed and produced by ATS Corporation, is a high-performance component meant for cooling down electronic systems. The heat sink measures 7.4" (length) by 4" (width) by 2.5" (height) and is made of extruded aluminum as its base material. This construction ensures maximum durability and thermal management for active devices. Furthermore, the ATS-52170B-C1-R0 has a base of 1/2" (dimension) by 4-1/2" (width) by 8" (length) and is 1/8" thick.

The heat sink also has a fin stack which has their length measured as 8.6" (inches) and their height 2-1/2" (inches). The fin stack is mainly responsible for the heat sink\'s cooling capabilities and it\'s made of a high-grade aluminum alloy. Additionally, the backside of the heat sink is designed without fins for easy installation and system integration. The fins are spaced 0.7" (inches) apart and the overall weight is 14 ounces (oz).

Application Field and Working Principle

The ATS-52170B-C1-R0 is designed to be installed in a variety of standard chassis and it\'s suitable for applications in telecommunications, industrial control systems, medical equipment, and HVAC systems. The heat sink can also be deployed in automotive, avionics and military applications thanks to its IP67 rating. The ATS-52170B-C1-R0 is a sleveless type so it can\'t be attached directly to the host board. It can, however, be adapted to fit 100mm and 140mm fan sizes.

The ATS-52170B-C1-R0 is able to cool down the target devices thanks to its continuous air over heatsink technique. That is, the desired heat (thermals) are pulled from the targeted devices and transferred to the heat sink using a continuous airflow. The fan provided with this unit works in conjunction with the heat sink to guarantee maximum cooling performance. This design has an air gap main body and fins, so it can efficiently transfer heat and keep the temperature of the system low.

The ATS-52170B-C1-R0 heat sink is also designed with fin spacers, which reduce turbulence and create a sufficient air flow for even more efficient cooling. The base also features mounting points for better fixation. The heat sink\'s overall temperature resistance is up to 308°F (150°C) and it can maintain a maximum thermal power-load up to 20 watts (W). Moreover, the unit is RoHS compliant and approved.

Conclusion

The ATS-52170B-C1-R0 is a high-quality thermal management solution built for longevity and stability. Designed for environments with extreme temperatures, the heat sink has been optimized for use with 100mm and 140mm fan sizes and to endure until temperatures of up to 308°F (150°C). Thanks to its robust construction using a continuous air over heatsink technique, it\'s able to ensure reliable thermal management for various electronic devices.

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