Allicdata Part #: | ATS1114-ND |
Manufacturer Part#: |
ATS-52170G-C1-R0 |
Price: | $ 4.98 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEAT SINK 17MM X 17MM X 12.5MM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-52170G-C1-R0 Datasheet/PDF |
Quantity: | 705 |
1 +: | $ 4.52340 |
10 +: | $ 4.39803 |
25 +: | $ 4.15372 |
50 +: | $ 3.90940 |
100 +: | $ 3.66509 |
250 +: | $ 3.42075 |
500 +: | $ 3.17641 |
1000 +: | $ 3.11532 |
Specifications
Series: | maxiFLOW |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Angled Fins |
Length: | 0.669" (17.00mm) |
Width: | 0.669" (17.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.492" (12.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 11.10°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal Heat Sinks are commonly used to control and manage heat from a device or component in an electronic system. The ATS-52170G-C1-R0 Heat Sink is designed to help with the effective dissipating of high amounts of heat from more complicated devices and systems. This guide will cover the application field and working principle of the ATS-52170G-C1-R0 Heat Sink.The ATS-52170G-C1-R0 Heat Sink is designed to be used with electronic components and devices that require effective heat dissipation. This is especially important for more complex devices and components that generate more heat than normal. The Heat Sink’s main purpose is to keep any components from overheating and sustaining damage due to the high amount of heat generated by the device or component.The ATS-52170G-C1-R0 Heat Sink is a combination of high-performance aluminum and copper construction, ensuring that the Heat Sink can effectively dissipate large amounts of heat at a rapid rate. The Heat Sink also includes built-in fan guides which provide efficient air circulation around the device or component, helping to cool it down faster. These fan guides also help to ensure that the Heat Sink’s internal parts do not become over-heated.When it comes to the application field of the ATS-52170G-C1-R0, this Heat Sink is used with all types of electronic and digital components. This includes desktop computers, laptops, servers, routers, switches, and other sophisticated electronic components and devices. It provides effective heat dissipation for any of these devices and components, helping them to remain in good condition for longer.The working principle of the ATS-52170G-C1-R0 Heat Sink is quite simple. When the Heat Sink is installed on a device or component, the aluminum will absorb the heat generated by the device and then dissipate it rapidly. This helps to keep the device from overheating and damaging any internal components. The copper parts then aid in furthering the rate of heat dissipation, helping the device remain in good condition for longer. Additionally, the fan guides provide efficient air circulation around the device, helping to cool it down further.To ensure that the ATS-52170G-C1-R0 Heat Sink is able to effectively dissipate heat, it must be properly installed on the device or component. This includes attaching the Heat Sink directly onto the device or component. Additionally, the Heat Sink must also be firmly secured with screws or other fastening components. Once installed, it is then able to provide effective heat dissipation.In conclusion, the ATS-52170G-C1-R0 Heat Sink is designed to help keep any electronic or digital components in good condition for longer. It includes a combination of high-performance aluminum and copper construction which helps to dissipate heat quickly and efficiently. Additionally, the device is suitable for a wide variety of electronics and digital components, ranging from desktop computers to servers. Finally, when it comes to installation, the Heat Sink must be firmly attached to the device or component for maximum efficiency.
The specific data is subject to PDF, and the above content is for reference
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