ATS-52170P-C0-R0 Allicdata Electronics
Allicdata Part #:

ATS-52170P-C0-R0-ND

Manufacturer Part#:

ATS-52170P-C0-R0

Price: $ 5.31
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 17X17X17.5MM W/OUT TIM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-52170P-C0-R0 datasheetATS-52170P-C0-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.77729
30 +: $ 4.51164
50 +: $ 4.24633
100 +: $ 3.98091
250 +: $ 3.71552
500 +: $ 3.45012
1000 +: $ 3.38377
Stock 1000Can Ship Immediately
$ 5.31
Specifications
Series: maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Angled Fins
Length: 0.669" (17.00mm)
Width: 0.669" (17.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.689" (17.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.30°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-52170P-C0-R0 thermal-heat sinks are extensively used in many industrial and commercial settings. These heat sinks absorb and dissipate heat from the heat sources and are designed to help maintain optimal performance in many applications, such as data centers, refrigeration systems, automotive components, etc. The ATS-52170P-C0-R0 thermal-heat sinks are suitable for devices with moderate to high power dissipation. They feature a highly efficient system of thermal-heat dissipation, capable of efficiently managing warm temperatures and prevent harm to surrounding components.

The ATS-52170P-C0-R0 thermal-heat sinks employ the principle of natural convection whereby air is the vehicle for heat transfer from the heat source to the heat sink. Warm air flows around the heat sink, transferring the heat away from the heat source. This design also helps keep the heat from becoming concentrated in one area, preventing any damage to the device or components.

The ATS-52170P-C0-R0 thermal-heat sinks are built with heavy-duty materials which can withstand extreme temperatures. The heat sinks come with a variety of features including high conductivity aluminum bases, aluminum fins, nickel-plated copper heat pipes, active fan cooling, and adjustable fan speed controls. In order to ensure efficient heat dissipation, each heat sink unit is equipped with an accurate temperature sensor that provides the exact temperature reading of the heat spreader.

The ATS-52170P-C0-R0 thermal-heat sinks feature a wide variety of design options, allowing them to be used in a variety of settings. They have the ability to reduce operational costs, reduce labor costs, and reduce overall environmental impact. Integrated fan speed control allows for efficient operation of the device, while its adjustable fins height helps ensure optimal cooling performance. The heat sinks also come with an easy to install installation process allowing for quick installation and removal for maintenance.

The ATS-52170P-C0-R0 thermal-heat sinks are reliable and efficient solutions for many applications. They are designed for long-term, continuous cooling and can endure harsh environments and extreme temperatures. The heat sinks are designed with state-of-the-art practice which has enabled thermal engineers to create highly efficient cooling solutions for many applications. No matter the nature or complexity of the project, the ATS-52170P-C0-R0 thermal-heat sinks are up to the job.

In conclusion, the ATS-52170P-C0-R0 thermal-heat sinks are a reliable and efficient solution for managing heat in many applications. They offer efficient heat dissipation, along with a wide range of design options. Their easy installation process and adjustable fan speed controls make them great for many applications. They are a great choice for any cooling application and are sure to provide years of reliable cooling.

The specific data is subject to PDF, and the above content is for reference

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