| Allicdata Part #: | ATS-52190P-C0-R0-ND |
| Manufacturer Part#: |
ATS-52190P-C0-R0 |
| Price: | $ 5.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 19X19X17.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: | ATS-52190P-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22270 |
| 30 +: | $ 4.93269 |
| 50 +: | $ 4.64247 |
| 100 +: | $ 4.35229 |
| 250 +: | $ 4.06214 |
| 500 +: | $ 3.77198 |
| 1000 +: | $ 3.69945 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Angled Fins |
| Length: | 0.748" (19.00mm) |
| Width: | 0.748" (19.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important component of most systems. Unfortunately, without proper heat dissipation, a system may overheat, leading to a variety of problems, including performance decreases, component failure, and even system shutdown. Heat sinks, like the ATS-52190P-C0-R0, are one of the most efficient ways to dissipate heat in a system. In this article, we\'ll discuss the application field and working principle of the ATS-52190P-C0-R0.
Application Field of ATS-52190P-C0-R0
The ATS-52190P-C0-R0 is a high-performance aluminum heat sink that is designed to provide efficient cooling and dissipate heat from high-powered processors and other components. The ATS-52190P-C0-R0 is designed to provide optimal cooling performance in tight spaces due to its slim design. This heat sink is perfect for applications like home computer systems, gaming consoles, and other high-performance electronic equipment.
Working Principle of ATS-52190P-C0-R0
The ATS-52190P-C0-R0 works on the principle of Natural Convection Heat Transfer. This is the process of heat transfer by the circulation of a fluid, such as air, due to differences in temperature between the fluid and the surrounding surface or objects. In the case of the ATS-52190P-C0-R0, this fluid is air and it is used to move heat away from the processor or other component, and dissipate it throughout the system.
The ATS-52190P-C0-R0 has an optimized shape and surface texture that facilitate enhanced heat transfer by forcing air to move over the entire surface of the heat sink. This type of heat sink is designed to make efficient use of air, allowing it to flow over the cooling fins with minimal turbulence and storing the heat absorbed from the CPU in its large thermal mass. As the air picks up the heat, it is expelled by the fins, thus cooling the CPU and other components.
Conclusion
The ATS-52190P-C0-R0 is a high-performance aluminum heat sink that is designed to provide efficient cooling and dissipate heat from high-powered processors and other components. These heat sinks use the principle of Natural Convection Heat Transfer in order to move heat away from the processor and other components, and dissipate it throughout the system. It is perfect for applications like home computer systems, gaming consoles, and other high-performance electronic equipment.
The specific data is subject to PDF, and the above content is for reference
ATS-52190P-C0-R0 Datasheet/PDF