ATS-52210G-C0-R0 Allicdata Electronics
Allicdata Part #:

ATS-52210G-C0-R0-ND

Manufacturer Part#:

ATS-52210G-C0-R0

Price: $ 4.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 21X21X12.5MM W/OUT TIM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-52210G-C0-R0 datasheetATS-52210G-C0-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.15233
30 +: $ 3.92175
50 +: $ 3.69104
100 +: $ 3.46040
250 +: $ 3.22971
500 +: $ 2.99902
1000 +: $ 2.94134
Stock 1000Can Ship Immediately
$ 4.61
Specifications
Series: maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Angled Fins
Length: 0.827" (21.00mm)
Width: 0.827" (21.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.492" (12.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.20°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions have become increasingly important in today’s modern electronics, as the complexity and size of electronics design has increased significantly, due to the ever-growing demand for better performance and higher power-per-unit area. The use of high-performance, low-noise, high-reliability thermal management solutions is essential for proper operation of the electronics and systems. One of the most efficient thermal management solutions is the ATS-52210G-C0-R0.

The ATS-52210G-C0-R0 is a novel heat sink that uses the convective heat transfer mechanism to efficiently dissipate heat away from the electronics. The heat sink utilizes a unique cooling system, which combines a highly efficient copper heat exchanger and an optimized fan. This ensures high transfer rates and a low-noise operation. The heat sink is designed to be compatible with a wide variety of devices, including processors and power supplies.

The ATS-52210G-C0-R0 has several features that make it an ideal choice for thermal management. It features an innovative sliding fin design, which prevents air from becoming trapped and allows for an efficient cooling of the component or system. Additionally, the heat sink has a modular design with hot-swappable fan and heat exchanger modules, allowing for easy customization and upgrades. The fan is adjustable, allowing users to optimize their cooling performance by controlling the fan speed. Furthermore, the heat exchanger is designed to reduce heat concentration levels by ensuring a uniform distribution of the heat.

The ATS-52210G-C0-R0 offers several benefits over traditional air cooling methods. It has a more compact footprint, which makes it suitable for systems with limited space. Additionally, its low-noise operation ensures a quiet environment when operating at the higher fan speeds. It also offers improved longevity, as the fan is designed to be durable and reliable, so it won’t need frequent replacement.

The ATS-52210G-C0-R0 is ideal for applications where thermal management is critical. It is particularly useful for applications that require low-noise operation, such as gaming consoles and computer workstations. Additionally, it is suitable for applications where reliability is of the utmost importance, such as servers and medical equipment. It is also suitable for consumer products such as TVs and cell phones, as the improved cooling performance will help increase the lifespan of the device.

In conclusion, the ATS-52210G-C0-R0 is a highly efficient and reliable thermal management solution with a number of features that make it ideal for a wide variety of applications. It is easy to install, provides efficient cooling, operates quietly, and offers improved reliability over traditional air cooling solutions. The ATS-52210G-C0-R0 is a great choice for thermal management and is sure to be a perfect fit for many electronics systems.

The specific data is subject to PDF, and the above content is for reference

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