| Allicdata Part #: | ATS1116-ND |
| Manufacturer Part#: |
ATS-52210G-C1-R0 |
| Price: | $ 5.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 21MM X 21MM X 12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52210G-C1-R0 Datasheet/PDF |
| Quantity: | 463 |
| 1 +: | $ 4.61160 |
| 10 +: | $ 4.49001 |
| 25 +: | $ 4.24040 |
| 50 +: | $ 3.99092 |
| 100 +: | $ 3.74144 |
| 250 +: | $ 3.49201 |
| 500 +: | $ 3.24258 |
| 1000 +: | $ 3.18023 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Angled Fins |
| Length: | 0.827" (21.00mm) |
| Width: | 0.827" (21.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks encompasses a variety of products used to dissipate heat from a component or system. The ATS-52210G-C1-R0 thermal-heat sink is a low profile, efficient, and reliable component designed to cool electronic components in a wide variety of applications.
The ATS-52210G-C1-R0 utilizes proprietary, optimized time-phase temperature sensing (TP-TS) technology, which reduces the need for thick, bulky heatsinks. The TP-TS system allows the ATS-52210G-C1-R0 to sense and adjust the thermistor resistance values on over-temperature devices faster and more accurately than traditional systems. This feature also allows the device to quickly and precisely control the temperature of individual components, which helps to reduce overall system power use.
The ATS-52210G-C1-R0 is ideal for reducing the overall thermal resistance of an electrical system. With a thermoset design, the ATS-52210G-C1-R0 can dissipate up to 45W/in2 of thermal energy, which makes it suitable for applications that require high thermal conductivity. The device also features unique “Smart Fan” control technology, which dynamically adjusts the fan speed to ensure optimal cooling performance.
The ATS-52210G-C1-R0 is designed to operate in the temperature range of -40°C to 150°C. The device is constructed of a copper base and an aluminum heatsink, both of which allow for better thermal transfer than traditional materials. The device also utilizes a patented wave soldering technology, which provides a secure, reliable connection between the copper base and the aluminum heatsink, ensuring the highest thermal and electrical performance.
The ATS-52210G-C1-R0 offers high-powered cooling capabilities and reliable protection to electronic components or systems requiring thermal monitoring. The device utilizes TP-TS technology, superior materials, and unique Smart Fan control to achieve its impressive cooling performance. Additionally, the ATS-52210G-C1-R0 is designed to perform in a wide range of temperature conditions, making it an ideal choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference