| Allicdata Part #: | ATS-52270P-C0-R0-ND |
| Manufacturer Part#: |
ATS-52270P-C0-R0 |
| Price: | $ 5.59 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 27X27X17.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52270P-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.03181 |
| 30 +: | $ 4.75209 |
| 50 +: | $ 4.47250 |
| 100 +: | $ 4.19297 |
| 250 +: | $ 3.91343 |
| 500 +: | $ 3.63390 |
| 1000 +: | $ 3.56402 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Angled Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are a crucial component in modern technology. They help dissipate heat generated by electronic components and protect them from overheating. ATS-52270P-C0-R0 is a type of thermal heat sink designed for modern applications.
The ATS-52270P-C0-R0 thermal heat sink is designed for use in mobile and consumer electronics applications. Its anodized aluminum construction provides excellent thermal performance and durability. The heat sink has a large and flat fin surface area, allowing it to dissipate heat quickly and efficiently. It is lightweight, making it ideal for use in portable and mobile devices. The ATS-52270P-C0-R0 has a compact profile, allowing it to fit in tight spaces.
The ATS-52270P-C0-R0\'s working principle is simple but effective. In operation, the heat sink wicks away heat produced by the component it is attached to. The heat is then dissipated away from the component, thus preventing it from overheating. The aluminum fins of the heat sink act as conduits for heat, allowing hot air to escape and cool air to enter. This ensures that the component does not get too hot and operates at optimal temperatures.
The ATS-52270P-C0-R0 thermal heat sink is ideal for use in consumer electronics, laptops, tablets, and mobile phones. Its light-weight construction allows it to fit into a wide variety of applications. It is also highly resistant to corrosion and stands up to harsh conditions. Furthermore, the anodized aluminum construction provides superior thermal performance, making it perfect for applications where heat dissipation is critical.
In addition, the ATS-52270P-C0-R0 is highly reliable and easy to install. It comes with a full set of mounting screws and accessories, making it easy to assemble and get it up and running quickly. Moreover, the heat sink is compatible with a wide range of components and is designed to fit in almost any space. It is also very affordable, making it a cost-effective option for many applications.
The ATS-52270P-C0-R0 thermal heat sink is an excellent choice for any application that requires efficient heat dissipation. Its lightweight construction, high-performance materials, and durability make it perfect for use in modern devices. It is also very easy to install, making it a great solution for any application.
The specific data is subject to PDF, and the above content is for reference