| Allicdata Part #: | ATS1103-ND |
| Manufacturer Part#: |
ATS-52290B-C1-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 29MM X 29MM X 7.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52290B-C1-R0 Datasheet/PDF |
| Quantity: | 518 |
| 1 +: | $ 4.05090 |
| 10 +: | $ 3.94002 |
| 25 +: | $ 3.72103 |
| 50 +: | $ 3.50217 |
| 100 +: | $ 3.28331 |
| 250 +: | $ 3.06442 |
| 500 +: | $ 2.84554 |
| 1000 +: | $ 2.79081 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Angled Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.295" (7.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-52290B-C1-R0 Thermal - Heat Sinks Application Field and Working Principle
The ATS-52290B-C1-R0 is a highly efficient heat sink specifically designed for the elimination of excess heat generated by various electronics. This heat sink features a durable aluminum construction, and its high performance carbon-filled silicone thermal pad ensures excellent heat dissipation. Its wide range of application fields and versatile installability make it an ideal choice for a wide variety of applications.
Features:
- High-quality aluminum alloy construction
- Excellent thermal performance
- High-efficiency carbon-filled silicone thermal pad
- Wide range of application fields
- Versatile installability
Application Field
The ATS-52290B-C1-R0 can be used for a wide range of applications, including air conditioning and refrigeration systems, indoor air quality systems, and industrial equipment. It is also suitable for use in cooling electronic components in computer and networking systems, including motherboards, hard drives, memory modules, and processors.
Working Principle
The ATS-52290B-C1-R0 works by dissipating excess heat generated by electronic components. It features a high-performance carbon-filled silicone thermal pad, which is designed to absorb heat from electronic components and transfer this heat to the atmosphere. The heat is then dissipated from the heat sink via convection cooling, dissipating the heat to the environment.
The heat sink also features a durable and lightweight aluminum construction. This ensures effective, efficient heat dissipation, and also provides a secure mounting surface for the component. Additionally, the integrated clips and spring-starting pin design allows for easy installation and removal without requiring additional hardware.
Advantages
- High-performance carbon-filled silicone thermal pad for improved heat dissipation
- Lightweight construction for enhanced portability
- Integrated clips and spring-starting pin design for easy installation and removal
- Wide range of application fields and versatile installability
The ATS-52290B-C1-R0 thermal heat sink is an ideal choice for a wide range of applications. It features a durable aluminum construction, a high-performance carbon-filled silicone thermal pad, and an easy installation and removal. Its wide range of application fields and versatile installability make it an ideal choice for a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference