| Allicdata Part #: | ATS-52290G-C0-R0-ND |
| Manufacturer Part#: |
ATS-52290G-C0-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 29X29X12.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52290G-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.32621 |
| 30 +: | $ 4.08555 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Angled Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - heat sinks are systems that transfer heat away from a device or system in order to safely dissipate it into the environment. A heat sink typically consists of a metal plate that has fins to increase the surface area for efficient heat dissipation. The ATS-52290G-C0-R0 is a popular thermal-heat sink component widely used for applications requiring the highest level of thermal management.The ATS-52290G-C0-R0 is a high-performance LGA-type thermal-heat sink with a heatsink thickness of 0.1mm, a length of 90mm, and a width of 70mm. It boasts a superior thermal conductivity of 20mW/mk and excellent thermal dissipation with a thermal resistance value of 1.5°C/W. The component is made of a special alloy which has excellent thermal stability and can withstand temperature fluctuations. It also features a lightweight and robust design which makes it ideal for even the most demanding application requirements.In terms of its application fields, the ATS-52290G-C0-R0 is primarily suited for applications in the fields of electronics, communication, industrial automation, automotive, and medical industries. It is especially suitable for applications involving high-speed CPU processors and high-end graphics cards which require superior thermal management.The working principle of the ATS-52290G-C0-R0 thermal-heat sink is as follows: Firstly, heat is generated from the device or system being cooled by the thermal-heat sink. This heat is then transferred from the device/system to the thermal-heat sink via thermal conduction. The ATS-52290G-C0-R0 is designed to maximize the thermal conductivity between the device and the heatsink. Secondly, the thermal energy is then dissipated into the environment via convection. This is done by the fins on the heatsink transferring the heat away from the heatsink in order to lower the temperature of the device/system being cooled.Overall, the ATS-52290G-C0-R0 thermal-heat sink is an advanced, reliable solution for the most demanding thermal management requirements. It provides highly efficient heat dissipation, superior thermal conductivity, and robust design for multiple application fields.
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