Series:	maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Not Included)
Shape:	Square, Angled Fins
Length:	1.142" (29.00mm)
Width:	1.142" (29.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.689" (17.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.50°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-52290P-C0-R0 Application Field And Working Principle

Thermal - Heat SinksThe ATS-52290P-C0-R0 is a high-performance thermal solution designed for a wide variety of applications. It is a newly developed passive heatsink that takes advantage of thermal properties to provide reliable cooling in various thermal environments. The heat sink maximizes its cooling performance while maintaining a low profile overall.The ATS-52290P-C0-R0 is designed to operate in the most demanding scenarios. Its mid-profile design offers enhanced cooling capacity even in constrained thermal environments. The heat sink features a copper base with a fin structure that is capable of dissipating up to 55 watts of power. This ensures the maximum cooling performance without the need for extra fans.The ATS-52290P-C0-R0 uses advanced heat transfer technology to provide reliable thermal operation. The heat sink features advanced thermal simulation technology, allowing it to respond quickly and efficiently to temperature changes. This helps to improve its total cooling performance.The ATS-52290P-C0-R0 also features an active cooling design. Its optimized fan design allows for improved airflow and reduced noise. The fan is designed to run at an optimal speed to avoid build-up of heat on the heat sink. The fan is also designed to operate at the lowest possible noise level so that it does not disrupt users or other components in the system.The ATS-52290P-C0-R0 is designed to meet the highest standards of thermal performance. It uses a combination of high-performance materials, advanced thermal simulation, and intelligent fan design to offer optimum thermal performance. The heat sink is also designed to offer a low profile design for easy integration into existing systems.The ATS-52290P-C0-R0 is a versatile thermal solution for various applications. It is designed to be used in high-performance systems such as gaming PCs, workstations, and servers. The heat sink also is suitable for use in data centers and other high-heat producing environments. It is also ideal for use in industrial and automotive applications. The ATS-52290P-C0-R0 can be used in applications that require efficient cooling in a wide range of thermal environments. It is capable of handling large amounts of heat in high-performance settings such as gaming PCs. It is also ideal for medium-level heat generation in data centers and other sensitive environments. The heat sink can also be used in industrial and automotive applications where efficient cooling is required.The working principle of the ATS-52290P-C0-R0 is simple. It uses a combination of air and metal to effectively dissipate heat. Air is used to transport heat away from the source, and the metal acts as a conductor to transfer the heat to the surrounding environment. The heat sink is designed to minimize heat buildup and maximize cooling efficiency, allowing it to dissipate more heat faster.In conclusion, the ATS-52290P-C0-R0 is an advanced thermal solution designed to provide reliable cooling in a variety of applications. It uses a combination of advanced heat transfer technology, optimized fan design, and low profile design to offer the best thermal performance. The heat sink is also suitable for use in high-performance systems, data centers, and other high-heat producing environments.

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