ATS-52290P-C1-R0

Series:	maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Angled Fins
Length:	1.142" (29.00mm)
Width:	1.142" (29.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.689" (17.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.50°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionThermal - Heat Sinks are devices used to dissipate or spread out heat generated by electrical and electronic components. By doing so, they help to maintain a regulated operating temperature and keep the components from overheating and consequently getting damaged. The ATS-52290P-C1-R0 is a thermal heat sink used in applications where cooling or heat dissipation is necessary. This article will explain the application field and working principle of the ATS-52290P-C1-R0 heat sink to provide readers with a better understanding of the device. Application FieldThe ATS-52290P-C1-R0 heat sink is especially suited for use in devices such as power adapters, LED lamps and LED drivers, as well as with high power switching devices. These types of devices often generate considerable amounts of heat, which can drastically reduce their lifespan and efficiency if left unchecked. By dissipating this heat away from the components, the device helps to maintain a regulated operating temperature and protect the components from damage.Working PrincipleThe ATS-52290P-C1-R0 utilizes a simple, yet effective, design to achieve an optimal amount of cooling. It is made up of a flat rectangular base with multiple fins running across it. Heat is dissipated through conduction, convection and radiation. When the device is in operation, heat from the components transfers into the heat sink. The fins provide a large surface area that helps to disperse the heat away from the components and allow air to circulate over the surface of the heat sink, cooling it down. This helps to maintain a regulated temperature and keep the components from overheating and failing prematurely.BenefitsThe ATS-52290P-C1-R0 has a number of benefits that make it an ideal choice for applications involving heat dissipation. It is designed to be compact and lightweight, so it can be easily integrated into electronic devices. It also features a robust construction and is made from high-quality materials, ensuring a long service life. The device is also designed to be resistant to corrosion and feature a low contact resistance. This ensures that heat is efficiently and quickly dissipated from the components, helping to maintain a regulated operating temperature. ConclusionThe ATS-52290P-C1-R0 is a thermal heat sink designed to dissipate or spread out heat generated by electrical and electronic components. It is especially suitable for use in devices such as power adapters, LED lamps and LED drivers, as well as with high power switching devices. The device is known for its compact and lightweight design, robust construction, and its resistance to corrosion and low contact resistance. By efficiently dissipating heat away from components, the ATS-52290P-C1-R0 helps to maintain a regulated temperature and keep the components from overheating and ultimately damaging.

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