| Allicdata Part #: | ATS1121-ND |
| Manufacturer Part#: |
ATS-52300G-C1-R0 |
| Price: | $ 5.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 30MM X 30MM X 12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52300G-C1-R0 Datasheet/PDF |
| Quantity: | 574 |
| 1 +: | $ 4.85100 |
| 10 +: | $ 4.71870 |
| 25 +: | $ 4.45662 |
| 50 +: | $ 4.19454 |
| 100 +: | $ 3.93233 |
| 250 +: | $ 3.67018 |
| 500 +: | $ 3.40802 |
| 1000 +: | $ 3.34249 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Angled Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.40°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Product Description: ATS-52300G-C1-R0 has been designed to provide excellent thermal solutions for contemporary electronic components such as CPUs, GPUs and Chipsets that are used in today’s high performance computing and storage systems. This thermal heat sink has an integrated, high-performance, quiet fan for active cooling and ensures excellent thermal conductivity and user-friendly installation.
Application Field: ATS-52300G-C1-R0 is a thermal heat sink with active cooling, designed for high performance computing and storage systems. Featuring superior thermal conductivity, the product is suitable for cooling CPUs, GPUs and chipsets. It is also used in industrial, medical, and military applications including various embedded systems and harsh environment applications.
Working Principle: When mounted on a heat-generating device, ATS-52300G-C1-R0 works on the principle of thermal conduction. Heat generated by the electronic components is transmitted from the heat-generating device into the thermal heat sink. The integrated fan then circulates air inside the thermal heat sink to push out the heat and cool the electronic components. The fan is designed to operate quietly in order to ensure minimal disruption to any operations the component is involved in.
Conclusion: ATS-52300G-C1-R0 is ideal for cooling CPUs, GPUs and chipsets used in high-performance computing and storage systems, and is suitable for use in a number of different types of applications. The product excels in both thermal conductivity and user-friendliness, making it a great choice for any demanding thermal application. The integrated fan provides active cooling and ensures excellent heat dissipation, while keeping noise levels to a minimum.
The specific data is subject to PDF, and the above content is for reference