| Allicdata Part #: | ATS1122-ND |
| Manufacturer Part#: |
ATS-52310G-C1-R0 |
| Price: | $ 5.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 31MM X 31MM X 12.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52310G-C1-R0 Datasheet/PDF |
| Quantity: | 882 |
| 1 +: | $ 4.89510 |
| 10 +: | $ 4.76469 |
| 25 +: | $ 4.49996 |
| 50 +: | $ 4.23524 |
| 100 +: | $ 3.97051 |
| 250 +: | $ 3.70581 |
| 500 +: | $ 3.44111 |
| 1000 +: | $ 3.37494 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Angled Fins |
| Length: | 1.220" (30.99mm) |
| Width: | 1.220" (30.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.492" (12.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
THERMAL - HEAT SINKS
The ATS-52310G-C1-R0 is a member of a family of thermal and heat sink solutions designed to meet the demands of today’s most intensive electronic and electrical applications. This model, along with the rest of the ATS family, has been designed to complement the standard IO functions and Operating Systems for the increasingly sophisticated arenas of smart devices, industrial, and medical electronics, as well as for computer systems and communications.
The ATS-52310G-C1-R0 is a thermal-dissipating device with a range of features that optimizes heat transfer and optimizes the capabilities of its associated devices. Its thermally conductive materials enable an optimal interface between warm components and air, while its specialized manufacturing process minimizes thermal impedance to maximize cooling. Furthermore, its design conformance to international standards enables consistent performance over a wide range of temperatures, while its sturdy build promises years of reliable performance. In terms of heat sink design, the ATS-52310G-C1-R0 is second-to-none.
The ATS-52310G-C1-R0 is comprised of a series of active components embedded within a lightweight housing to form the overall unit. Among these components are thermally conductive plates for enhanced thermal exchange, integrated heat pipes for improved convection, and a fan assembly for active cooling – all of which work together to provide efficient thermal management. The ATS-52310G-C1-R0 also includes a bezel-mounted configuration for improved installation, and flexible mounting options which enable vertical orientation with little reorientation work.
The ATS-52310G-C1-R0 is highly compatible with a range of different electronic subsystems, and is sought after by system designers for its cost-effectiveness. It is a favored solution for system designers who are looking for an efficient thermal solution that is capable of dissipating high volumes of heat without relying on excessive airflow to keep components running. Furthermore, it is designed with modular components that are easily modified or replaced to address any given application’s specific needs.
The ATS-52310G-C1-R0 is the ideal solution for those who need optimum performance from their electrical and electronic systems without sacrificing efficiency. Its active cooling solution reduces the amount of airflow necessary to keep components operating at optimal temperatures, and its modular components provide flexibility for easy alteration of the system to suit any application’s requirements. With its thermally conductive materials, integrated heat pipes, bezel-mounted configuration, and flexible mounting options, the ATS-52310G-C1-R0 is the go-to option for those who demand maximum quality and reliability.
The specific data is subject to PDF, and the above content is for reference