ATS-52330G-C1-R0

Series:	maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Angled Fins
Length:	1.299" (32.99mm)
Width:	1.299" (32.99mm)
Diameter:	--
Height Off Base (Height of Fin):	0.492" (12.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.50°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks are an important part of any electronic device as the heat generated needs to be dissipated in order to keep the system operating efficiently and to extend its life expectancy. The ATS-52330G-C1-R0 is a thermal - heat sink with an impressive range of applications and an innovative design.The ATS-52330G-C1-R0 is widely used in the industrial sector, mainly in fan and motor controllers. It is compatible with PWM fans or standard motors, making it ideal for a variety of applications. It is designed to dissipate heat away from the electronic components, maintaining the desired operating temperature. This helps extend the life of the components and increase their reliability and performance.The ATS-52330G-C1-R0 features a copper-based, pin-fin design that ensures optimal heat conduction. It has a maximum operating temperature of 75°C and a power rating of up to 40W, with a direct 110 mW/K power dissipation capacity. The copper base is surrounded by aluminum fins that draw heat away, ensuring efficient heat dissipation. The advanced design ensures a low acoustic noise level and vibration-free operation, making it ideal for applications where noise and vibration must be kept to a minimum.The ATS-52330G-C1-R0 has a variety of mounting options, including air and water. The mounting plate is included with the unit, allowing for a quick and easy installation process. It can be secured to the board with an adhesive tape, or secured to the board with a screw. The heat sink comes with two mounting brackets for mounting fans and other components.The ATS-52330G-C1-R0 is designed to provide a better and more efficient way of dissipating heat away from the electronic devices. It is a reliable and durable solution that can handle a wide range of temperatures and power ratings. The copper-based, pin-fin design helps to draw heat away from the components, while the heat sink’s low acoustic noise and vibration-free operation make it ideal for demanding environments. The unit is simple to install and provides cost-effective cooling for a variety of applications.

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