ATS-52330P-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1141-ND

Manufacturer Part#:

ATS-52330P-C1-R0

Price: $ 6.43
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 33MM X 33MM X 17.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-52330P-C1-R0 datasheetATS-52330P-C1-R0 Datasheet/PDF
Quantity: 241
1 +: $ 5.84010
10 +: $ 5.68071
25 +: $ 5.36533
50 +: $ 5.04970
100 +: $ 4.73407
250 +: $ 4.41847
500 +: $ 4.10286
1000 +: $ 4.02396
Stock 241Can Ship Immediately
$ 6.43
Specifications
Series: maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Angled Fins
Length: 1.299" (32.99mm)
Width: 1.299" (32.99mm)
Diameter: --
Height Off Base (Height of Fin): 0.689" (17.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are used in many electronic, industrial and consumer applications, where it is important to minimize the effects of heat on sensitive components. The ATS-52330P-C1-R0 is a high-performance heat sink that delivers efficient thermodynamic performance in challenging environments.

The ATS-52330P-C1-R0 is designed for systems that have small thermal budgets or require a high level of performance for extended periods of time. The heat sink has a unique hexagonal shape, with a total mass range of between 480-530 grams. The material composition is a combination of 58% aluminum and 42% copper, and it has a thermal conductivity of 25.5 W/m-K.

The ATS-52330P-C1-R0 is designed to provide efficient heat dissipation from power semiconductor components such as high-voltage rectifiers, high power transistors, and computer processors. The advanced design of the heat sink ensures maximum efficiency within temperature ranges from -30 to 150 degrees Celsius (-22 to 302 degrees Fahrenheit).

At the core of the ATS-52330P-C1-R0 is its effective heat dissipation technology. This incorporates a combination of direct contact and convection cooling methods, to ensure rapid cooling of components even under operational stress. The heat sink is designed to facilitate the flow of air away from the component, allowing it to dissipate temperature more quickly.

The ATS-52330P-C1-R0 is also fitted with an efficient fan system to increase airflow across the surface of the heat sink. This fan system is designed to provide the necessary cooling power to keep temperatures low, even when the device is under sustained load. The fan system also ensures a quieter operation, with noise levels of less than 20dBA.

The ATS-52330P-C1-R0 is ideal for a range of applications, from simple consumer electronics to complex industrial systems. Its combination of high efficiency and low noise levels makes it a perfect choice for applications that require superior thermal management. The heat sink is also available with a range of optional mounting hardware, enabling it to be customized to fit any particular setup.

The ATS-52330P-C1-R0 is an advanced heat sink, providing high levels of performance and reliability. Its unique design and efficient cooling system makes it the perfect choice for a range of applications, providing efficient, reliable cooling for long-term use.

The specific data is subject to PDF, and the above content is for reference

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