| Allicdata Part #: | ATS1108-ND |
| Manufacturer Part#: |
ATS-52350B-C1-R0 |
| Price: | $ 4.63 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 35MM X 35MM X 7.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52350B-C1-R0 Datasheet/PDF |
| Quantity: | 156 |
| 1 +: | $ 4.21470 |
| 10 +: | $ 4.10004 |
| 25 +: | $ 3.87248 |
| 50 +: | $ 3.64468 |
| 100 +: | $ 3.41693 |
| 250 +: | $ 3.18914 |
| 500 +: | $ 2.96134 |
| 1000 +: | $ 2.90439 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Angled Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.295" (7.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an essential aspect in the field of engineering and electronics. The ATS-52350B-C1-R0 is a device that serves the purpose of degrading localized temperature conditions in electronic components. Using a combination of metallic fins, forced air convection, and heat dissipating material, the device offers exemplary performance in terms of thermal efficiency. In this article, we will take a look at the application field and working principle of the ATS-52350B-C1-R0.
Application Field
The ATS-52350B-C1-R0 is a 1U Active Thermal Solution mainly used to cool CPUs and GPU’s in server and other network-related devices. It is a high power heat sink, having a power capacity of up to 80W, which is ideal for larger components. The ATS-52350B-C1-R0 is especially well suited for devices with multiple cores that require extra cooling power. The device also features an integrated fan that ensures proper air circulation.
Working Principle
The ATS-52350B-C1-R0 is a passive thermal solution that works without external fans. It is made up of a base with several thermally conductive fins protruding at right angles, which allow for heat to disperse more evenly. The base itself is composed of a heat-dissipating material layer, suitable for the required power capacity. This in turn helps to spread the heat over a wider surface area, allowing it to diffuse more effectively. The finned heat sinks also increase the surface area for more efficient heat transfer. The integrated fan ensures proper air circulation, while a baffle design reduces the effect of air turbulence and power consumption. The combination of these features ensures maximum thermal efficiency.
Conclusion
The ATS-52350B-C1-R0 is an advanced thermal solution device that offers effective heat dissipation for various electronic components. With a base made of a heat-dissipating material layer, a combination of metal fins and forced air convection, and an integrated fan, the device can be used to cool CPUs and GPU’s in servers and other network-related devices. It is also capable of handling up to 80W of power, making it suitable for larger components. The combination of these features provides exemplary performance in terms of thermal efficiency.
The specific data is subject to PDF, and the above content is for reference