ATS-52350G-C1-R0

Series:	maxiFLOW
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Angled Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.492" (12.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.00°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks have come a long way since their initial inception, and the ATS-52350G-C1-R0 is a prime example of how they have evolved. This heat sink is designed to provide efficient cooling to GPUs, with its design that features a combination of both passive and active cooling. It has the capacity to dissipate excess heat in a quick manner, so that the GPU can continue to operate in its optimal conditions without overheating.The ATS-52350G-C1-R0 is a robust device that offers excellent heat transfer rates and thermal stability. It is designed to maximize its surface area to create better heat distribution resulting in an overall optimal cooling performance. Additionally, its low profile design ensures that it does not take up too much space and can easily fit into predetermined sizes. The ATS-52350G-C1-R0 uses a combination of a passive and active cooling system. The passive cooling system comes with an array of heat pipes which is used to circulate heat from the hot components to the finned arrays, so that it can be dissipated into the external environment. The active cooling system consists of a fan which helps to create airflow over or around the heat dissipating surfaces, thus increasing the rate of dissipation of heat. Furthermore, the fan can be adjusted to match the exact cooling requirements of the application, so that the required temperature can be achieved and maintain accordingly.This heat sink is designed to resist thermal shocks and to sustain heavy-duty operations over extended periods of time. It features a copper baseplate which helps to absorb and transfer heat from the components, with fins above the baseplate which are configured in an array of straight and angled sections to allow for maximum heat dissipation. The ATS-52350G-C1-R0 is also equipped with a plastic backplate to avoid damaging the delicate components during its installation and to eliminate the need for additional insulation.The ATS-52350G-C1-R0 can be used for a variety of application fields, from cooling GPUs in gaming rigs to cooling CPUs in data centers. Its impressive heat transfer rates and thermal stability make the ATS-52350G-C1-R0 an ideal choice for any application that has stringent thermal reliability and performance requirements. Additionally, its low profile design and ease of installation makes it a great choice for those who want to conserve space or those that need to optimize their cooling capacity without too much hassle. As a thermal - heat sink, the ATS-52350G-C1-R0 has proven to be a reliable and efficient cooling device. With its combination of both passive and active cooling, and its impressive heat transfer and thermal stability, the ATS-52350G-C1-R0 is an excellent choice for a variety of applications. Its low profile design and ease of installation make it an ideal choice for those that need to optimize their cooling in cramped or space-restricted environments, while its impressive performance makes it a great choice for those that need reliable and efficient cooling, no matter the application.

The specific data is subject to PDF, and the above content is for reference