| Allicdata Part #: | ATS-52350P-C0-R0-ND |
| Manufacturer Part#: |
ATS-52350P-C0-R0 |
| Price: | $ 5.87 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X17.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52350P-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.28633 |
| 30 +: | $ 4.99233 |
| 50 +: | $ 4.69867 |
| 100 +: | $ 4.40502 |
| 250 +: | $ 4.11135 |
| 500 +: | $ 3.81769 |
| 1000 +: | $ 3.74427 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Angled Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical part of any high-performance electronics application. Heat is an unavoidable by-product of the system, and if it isn’t adequately managed, the performance of the device can suffer. In order to address the heat management challenge, many systems utilize heat sinks or cooling devices. These devices help convey and dissipate thermal energy from electronic components so that they operate within acceptable levels.
The ATS-52350P-C0-R0 Thermal Heat Sink from ATS is a high performance heat sink specifically designed for power-electronics applications in extreme environments. The ATS-52350P-C0-R0 is a low-profile, plug-in style unit that includes an integrated extruded heatsink and durable mounting bracket.
The ATS-52350P-C0-R0 can be used in a variety of applications, including LED lighting, motor control, safety sensitive equipment, and touch sensitive devices. Its compact size and low-profile design make it ideal for space-restricted environments, while its strong mounting bracket ensures secure attachment to the application.
ATS-52350P-C0-R0 features a multi-finned extruded aluminum body. Aluminum has excellent thermal conductivity, allowing heat from the power electronics to be efficiently conducted away from the device and dissipated into the ambient environment. The fins increase the surface area available for heat dissipation, allowing for higher performance and longer service life. The unit is also equipped with a fast-acting thermal switch which shuts off power to the application any time the temperature exceeds the maximum limit.
Another key feature of the ATS-52350P-C0-R0 Thermal Heat Sink is its unique passive air-impedance control technology. This technology is designed to allow air flow to be controlled and maintained for optimal performance. The device is also capable of dynamically adjusting to changing environmental conditions, further optimizing its cooling performance. This is especially useful in mobile applications, where environmental conditions can vary greatly.
Overall, The ATS-52350P-C0-R0 Thermal Heat Sink is an excellent choice for any power-electronics application in extreme environmental conditions. Its efficient thermal management features, dynamic air-impedance control, and durable construction make it an ideal choice for providing reliable cooling performance over long periods of time.
The specific data is subject to PDF, and the above content is for reference