| Allicdata Part #: | ATS1110-ND |
| Manufacturer Part#: |
ATS-52400B-C1-R0 |
| Price: | $ 3.87 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 40MM X 40MM X 7.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52400B-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 100 +: | $ 3.51823 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Angled Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.295" (7.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-52400B-C1-R0 application field and working principle
Thermal - Heat Sinks comprises a range of products which are designed to manage heat transfer efficiently. Thermal – Heat Sinks are commonly used in industrial applications where large amounts of heat is produced and must be dissipated. The ATS-52400B-C1-R0 Heat Sink is one of these products, and is designed to be used with higher powered applications. This article will explore the application field and working principle of the ATS-52400B-C1-R0 Heat Sink.
Applications
The ATS-52400B-C1-R0 Heat Sink can be used in a wide range of applications where heat is produced. These include power electronics and industrial automation, as well as medical and telecommunications equipment. This product is ideal for applications which require high thermal performance and reliability. It is also suitable for applications with high density packages, as it provides excellent thermal and electrical insulation.
The ATS-52400B-C1-R0 Heat Sink has been designed to meet the requirements of high-temperature applications. It can be used in applications which require up to a maximum operating temperature of 200°C, and is capable of dissipating up to 9.6W per centimeter cubed. The product has also been designed to provide an effective solution for applications which require air cooling, using a clip-on fan for further cooling.
Working Principle
The ATS-52400B-C1-R0 Heat Sink works by providing a high-efficiency heat transfer surface. This allows heat to be transferred away from the component or device, thus enabling it to operate at the desired temperature level. The product is made from a lightweight aluminum alloy which provides excellent thermal performance and stability. The aluminum alloy is also highly resistant to corrosion.
The ATS-52400B-C1-R0 Heat Sink has been designed to maximize the efficient transfer of heat away from the component or device. The product also features a high surface area, which enables heat to dissipate quickly and efficiently. The product also has a low thermal resistance which helps to ensure the efficient and reliable transfer of heat. The product also has a low thermal profile, which helps to keep the unit cool and reduce heat-related problems.
The ATS-52400B-C1-R0 Heat Sink also features a unique clip-on fan which can be used to further increase cooling capabilities. The fan is designed to move air evenly, resulting in a uniform cooling of the component and improved heat transfer. The fan is also designed to be easily removable, making it easy to clean and maintain.
The ATS-52400B-C1-R0 Heat Sink is a reliable and effective solution for applications which require high thermal performance and reliability. It is suitable for a wide range of applications and can handle high temperatures. The product also features a unique clip on fan for improved cooling capabilities, as well as a lightweight aluminum alloy for maximum thermal performance and stability. The ATS-52400B-C1-R0 Heat Sink is an excellent choice for any application in which heat transfer is essential.
The specific data is subject to PDF, and the above content is for reference