| Allicdata Part #: | ATS-52400P-C3-R0-ND |
| Manufacturer Part#: |
ATS-52400P-C3-R0 |
| Price: | $ 4.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X17.5MM W/T766 |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52400P-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 100 +: | $ 4.49177 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Angled Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are used in a variety of applications and situations in order to help dissipate heat from a specific surface or object. The ATS-52400P-C3-R0 is a type of heat sink specifically designed to dissipate heat from an electrical power device, such as a circuit board. This device is designed to provide a flat surface that will allow heat to dissipate over a wide area.
Applications
The ATS-52400P-C3-R0 is designed for use in electrical power devices, such as a circuit board. This heat sink is designed to dissipate heat from a circuit board by providing a flat surface that will allow heat to dissipate over a wide area. This heat sink can also be used in other applications such as computer fans and electronic components that generate high levels of heat. In addition, this device can be used in solar panels and other electrical devices that generate a high amount of heat.
Working Principle
The working principle of the ATS-52400P-C3-R0 is relatively simple. It consists of a flat surface and an aluminum fin structure that is designed to provide maximum heat dissipation. The device works to dissipate heat by cooling the air around the surface and drawing the heat away from the surface and into the fins. The fin structure is designed to provide a low-resistance path for the heat to travel, allowing it to dissipate quickly and efficiently. Once the heat is dissipated, it is then released into the air, providing a cooler environment.
Advantages
The advantage of the ATS-52400P-C3-R0 is its ability to provide a wide surface area for heat dissipation. This allows a large amount of heat to be dissipated quickly and efficiently. In addition, the aluminum fins are designed to provide a low-resistance path for heat to travel, allowing it to dissipate quickly and efficiently. This device also requires minimal maintenance and can be easily installed in a variety of locations and applications.
Conclusion
Overall, the ATS-52400P-C3-R0 is an ideal heat sink for electrical power devices. This device is designed to dissipate heat from a circuit board by providing a flat surface that will allow heat to dissipate over a wide area. The fin structure is designed to provide a low-resistance path for the heat to travel, allowing it to dissipate quickly and efficiently. In addition, this device requires minimal maintenance and can be easily installed in a variety of locations and applications.
The specific data is subject to PDF, and the above content is for reference