
Allicdata Part #: | ATS-52425P-C0-R0-ND |
Manufacturer Part#: |
ATS-52425P-C0-R0 |
Price: | $ 6.06 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 42.5X42.5X17.5MM NO TIM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 5.44824 |
30 +: | $ 5.14521 |
50 +: | $ 4.84268 |
100 +: | $ 4.53997 |
250 +: | $ 4.23730 |
500 +: | $ 3.93464 |
1000 +: | $ 3.85897 |
Specifications
Series: | maxiFLOW |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Square, Angled Fins |
Length: | 1.673" (42.50mm) |
Width: | 1.673" (42.49mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.689" (17.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 1.90°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Introduction
Thermal-Heat Sinks are used in many different applications to ensure optimal cooling performance, from the housing of consumer electronics to industrial application environments. The ATS-52425P-C0-R0 is a thermal-heat sink designed for a variety of cooling applications. This article will cover the application field for the ATS-52425P-C0-R0, the working principle of the thermal-heat sink and its advantages over other thermal-heat sink solutions.Application Field
The ATS-52425P-C0-R0 thermal-heat sink is commonly used in applications where high heat dissipation is a key factor in both thermal and mechanical performance. This includes consumer electronics, vehicle charging and power electronics, as well as industrial and commercial applications. As such, it is suitable for a wide range of applications, such as automotive, industrial, and consumer electronics.The ATS-52425P-C0-R0 also provides optimal thermal performance for applications with high temperature requirements. The heat sink can dissipate up to 2000 Watts of heat and maintain low thermal resistance. This is especially useful for applications with high clocks speeds and overclocking potential, allowing maximum performance without sacrificing the stability of the system.Working Principle
The ATS-52425P-C0-R0 draws heat away from the component and disperses it into the surrounding environment through the cooling fins. The thermal fins are specifically designed to increase the surface area, allowing maximum heat dissipation. The airflow provided by the fins also ensures that heat is dissipated from the component quickly, preventing heat accumulation from affecting performance.The ATS-52425P-C0-R0 also has a mounting system that allows users to easily install and secure the device into their system. This is done through a clip-on mechinism, which eliminates the need for additional screws and extra wiring.Advantages
The ATS-52425P-C0-R0 provides numerous benefits over other thermal-heat sink solutions. Firstly, the thermal-heat sink offers superior heat dissipation, allowing for maximum performance without compromising stability. In addition, the mounting system is extremely user-friendly, providing a fast and secure way to install the thermal-heat sink. This eliminates the need to be an expert in thermal-heat sinks in order to achieve maximum efficiency and performance.Finally, the ATS-52425P-C0-R0 is also compact and lightweight, making it easy to transport and handle. This makes it suitable for a variety of applications, as it can be conveniently moved and installed without taking up a lot of space.Conclusion
The ATS-52425P-C0-R0 is an ideal thermal-heat sink solution for applications where high heat dissipation is required. It offers superior heat dissipation, user-friendly mounting system, and a compact and lightweight design, making it an efficient and reliable thermal-heat sink solution.The specific data is subject to PDF, and the above content is for reference
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