| Allicdata Part #: | ATS-52450P-C0-R0-ND |
| Manufacturer Part#: |
ATS-52450P-C0-R0 |
| Price: | $ 6.10 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X17.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-52450P-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.49423 |
| 30 +: | $ 5.18910 |
| 50 +: | $ 4.88376 |
| 100 +: | $ 4.57853 |
| 250 +: | $ 4.27329 |
| 500 +: | $ 3.96806 |
| 1000 +: | $ 3.89175 |
| Series: | maxiFLOW |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Angled Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.689" (17.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 1.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has been gaining more importance in the industry, especially in the field of electronics and telecoms. It is important to be able to dissipate heat away from the component to ensure longer useful life and to keep the components temperature within its specified operating range. To this end, thermal management solutions have been developed to effectively manage heat dissipating from components. ATS-52450P-C0-R0 is one of the solutions designed for this purpose.
The ATS-52450P-C0-R0 is a high performance heat sink designed for cooling high power semiconductors. It is capable of handling power levels ranging from 15 Watts to 25 Watts at up to 25C junction temperature. This heat sink uses a natural convection cooling technology to efficiently dissipate heat into its surrounding environment. Its active cooling area is made up of an array of aluminum finned fins that are optimized to maximize the surface area for thermal transfer. Additionally, the fins are designed with a v-shape to create air channels for increased air flow.
In order to ensure the most efficient thermal management solution, the ATS-52450P-C0-R0 comes with several features. One of these is a built-in thermal sensor that is capable of detecting the temperature of the cooling surface and controlling the speed of the fan accordingly. Additionally, the heat sink has a layer of heat-conducting thermal grease, which increases the thermal transfer rate to quickly dissipate heat into the environment. Finally, the ATS-52450P-C0-R0 is designed to be mounted on a printed circuit board, providing an efficient air flow between the component and the heat sink.
The ATS-52450P-C0-R0 has a wide range of applications in the field of telecommunications, computer systems, motor control applications and many other thermal management circuits. In all of these applications, it is vital to efficiently transfer the heat away from the component in order to safeguard the life span and performance of the device. The ATS-52450P-C0-R0 provides an efficient, cost-effective solution for cooling high-power semiconductors.
The ATS-52450P-C0-R0 is a highly efficient solution for dissipating heat from high-power semiconductor components. Its efficient thermal design and its ability to quickly dissipate heat into the environment make it a highly desirable solution for heat management. Additionally, its ease of installation and its cost-effectiveness make it a great choice for cooling high-power applications. The ATS-52450P-C0-R0 is an ideal solution for those looking for an efficient and cost-effective way to manage the heat dissipation of their components.
The specific data is subject to PDF, and the above content is for reference